Abstract
Fixed, placed at regular distances inductors for induction heating of a rotating steel cylinder do not provide sufficiently uniform temperature profile along cylinder axis required by modern technologies,. The article examines the influence of inductors movement along the cylinder axis on the reduction of pick-to- pick temperature amplitude.
Abstract
Package delaminations are often associated with electrical and package reliability problems in IC devices. Delaminations caused by electrical-over-stress (EOS) and moisture expansion during reflow soldering have shown different delamination patterns. A Scanning Acoustic Microscope (SAM) can be used to detect package delaminations. Understanding these delamination signatures can help us quickly identify the failure cause at an early stage of the failure analysis.
Optimization of reflow soldering temperature curve based on genetic algorithm
