Monitoring of the temperature profile of vapour phase reflow soldering

Author(s):  
Lubomir Livovsky ◽  
Alena Pietrikova ◽  
Juraj Durisin
2017 ◽  
Vol 29 (1) ◽  
pp. 28-33 ◽  
Author(s):  
Barbara Dziurdzia ◽  
Janusz Mikolajek

Purpose The purpose of this paper is to evaluate selected methods of reduction voidings in lead-free solder joints underneath thermal pads of light-emitting diodes (LEDs), using X-ray inspection and Six Sigma methodology. Design/methodology/approach On the basis of cause and effect diagram for solder voiding, the potential causes of voids and influence of process variables on void formation were found. Three process variables were chosen: the type of reflow soldering, vacuum incorporation and the type of solder paste. Samples of LEDs were mounted with convection and vapour phase reflow soldering. Vacuum was incorporated into vapour phase soldering. Two types of solder pastes OM338PT and LFS-216LT were used. Algorithm incorporated into X-ray inspection system enabled to calculate the statistical distribution of LED thermal pad coverage and to find the process capability index (Cpk) of applied soldering techniques. Findings The evaluation of selected soldering processes of LEDs in respect of their thermal pad coverage and statistical Cpk indices is presented. Vapour-phase soldering with vacuum is capable (Cpk > 1) for OM338PT and LFS-216LT paste. Convection reflow without vacuum with LFS-216LT paste is also capable (Cpk = 1.1). Other technological soldering processes require improvements. Vacuum improves radically the capability of a reflow soldering for an LED assembly. When vacuum is not accessible, some improvement of capability to a lower extent is possible by an application of void-free solder pastes. Originality/value Six Sigma statistical methodology combined with X-ray diagnosis was used to check whether applied methods of void reduction underneath LED thermal pads are capable processes.


2019 ◽  
Vol 31 (3) ◽  
pp. 146-156 ◽  
Author(s):  
Balázs Illés ◽  
Attila Géczy ◽  
Bálint Medgyes ◽  
Gábor Harsányi

Purpose This paper aims to present a review of the recent developments in vapour phase soldering (VPS) technology. This study focuses on the following topics: recent developments of the technology, i.e. soft and vacuum VPS; measurement and characterization methods of vapour space, i.e. temperature and pressure; numerical simulation of the VPS soldering process, i.e. condensate layer and solder joint formation; and quality and reliability studies of the solder joints prepared by VPS, i.e. void content and microstructure of the solder joints. Design/methodology/approach This study was written according to the results of a wide literature review about the substantial previous works in the past decade and according to the authors’ own results. Findings Up to now, a part of the electronics industry believes that the reflow soldering with VPS method is a significant alternative of convection and infrared technologies. The summarized results of the field in this study support this idea. Research limitations/implications This literature review provides engineers and researchers with understanding of the limitations and application possibilities of the VPS technology and the current challenges in soldering technology. Originality/value This paper summarizes the most important advantages and disadvantages of VPS technology compared to the other reflow soldering methods, as well as points out the necessary further developments and possible research directions.


2020 ◽  
Vol 495 (3) ◽  
pp. 3160-3174 ◽  
Author(s):  
James E Owen

ABSTRACT Volatile species in protoplanetary discs can undergo a phase change from vapour to solid. These ‘snow lines’ can play vital roles in planet formation at all scales, from dust coagulation to planetary migration. In the outer regions of protoplanetary discs, the temperature profile is set by the absorption of reprocessed stellar light by the solids. Further, the temperature profile sets the distribution of solids through sublimation and condensation at various snow lines. Hence, the snow line position depends on the temperature profile and vice versa. We show that this coupling can be thermally unstable, such that a patch of the disc at a snow line will produce either runaway sublimation or condensation. This thermal instability arises at moderate optical depths, where heating by absorption of reprocessed stellar light from the disc’s atmosphere is optically thick, yet cooling is optically thin. Since volatiles in the solid phase drift much faster than volatiles in the vapour phase, this thermal instability results in a limit cycle. The snow line progressively moves in, condensing volatiles, before receding, as the volatiles sublimate. Using numerical simulations, we study the evolution of the carbon monoxide (CO) snow line. We find the CO snow line is thermally unstable under typical disc conditions and evolves inwards from ∼50 to ∼30 au on time-scales from 1000 to 10 000 yr. The CO snow line spends between ${\sim}10{{\ \rm per\ cent}}\,\mathrm{ and}\,50{{\ \rm per\ cent}}$ of its time at smaller separations, where the exact value is sensitive to the total opacity and turbulent viscosity. The evolving snow line also creates ring-like structures in the solid distribution interior to the snow line. Multiple ring-like structures created by moving snow lines could potentially explain the substructures seen in many ALMA images.


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