Reliability optimization for multilayer active RFID tags on rigid and flexible substrates

2011 ◽  
Author(s):  
Huang Jingyuan ◽  
Han Jiale ◽  
Zhang Zheming ◽  
Chen Haibin ◽  
Wu Jingshen
Keyword(s):  
Rfid Tags ◽  
Flexible Substrates ◽  
Reliability Optimization ◽  
Active Rfid

Electrical and mechanical properties of RFID chip joints assembled on flexible substrates

2015 ◽  
Vol 27 (1) ◽  
pp. 13-21 ◽  
Author(s):  
Kamil Janeczek ◽  
Małgorzata Jakubowska ◽  
Grażyna Kozioł ◽  
Anna Młożniak
Keyword(s):  
Mechanical Properties ◽  
Shear Force ◽  
Flexible Substrate ◽  
Conductive Adhesive ◽  
Curing Temperature ◽  
Rfid Tags ◽  
Processing Temperature ◽  
Flexible Substrates ◽  
Curing Time ◽  
Content Type

Purpose – The purpose of this paper is to examine electrical and mechanical properties of radio frequency identification (RFID) chip joints assembled on a flexible substrate and made from isotropic conductive adhesives (ICAs) reinforced with graphene nanoplatelets (GPNs) or graphite nanofibers (GFNs). Design/methodology/approach – The ICAs reinforced with GPNs or GFNs were prepared and screen printed on a test pattern to investigate resistance and thickness of these adhesive layers. Differential Scanning Calorimetry (DSC) was performed to assess a curing behaviour of the prepared ICAs. Then, RFID chips were mounted with the prepared ICAs to the pattern of silver tracks prepared on foil. Shear test was carried out to evaluate mechanical durability of the created chip joints, and resistance measurements were carried out to evaluate electrical properties of the tested ICAs. Findings – The 0.5 per cent (by weight) addition of GFNs or GPNs to the ICA improved shear force values of the assembled RFID chip joints, whereas resistance of these modified adhesives increased. The DSC analysis showed that a processing temperature of the tested adhesives may range from 80 to 170°C with different curing times. It revealed a crucial influence of curing time and temperature on electrical and mechanical properties of the tested chip joints. When the chip pads were cured for too long (i.e. 60 minutes), it resulted in a resistance increase and shear force decrease of the chip joints. In turn, the increase of curing temperature from 80 to 120°C entailed improvement of electrical and mechanical properties of the assembled chips. It was also found that a failure location changed from the chip – adhesive interface towards the adhesive – substrate one when the curing temperature and time were increased. Research limitations/implications – Further investigations are required to examine changes thoroughly in the adhesive reinforced with GFNs after a growth of curing time. It could also be worth studying electrical and mechanical properties of the conductive adhesive with a different amount of GFNs or GPNs. Practical implications – The tested conductive adhesive reinforced with GFNs or GPNs can be applied in the production of RFID tags because it may enhance the mechanical properties of tags fabricated on flexible substrates. Originality/value – Influence of GFNs and GPNs on the electrical and mechanical properties of commercial ICAs was investigated. These properties were also examined depending on a curing time and temperature. New conductive materials were proposed and tested for a chip assembly process in fabrication of RFID tags on flexible substrates.

A dual-resonant patch antenna for miniaturized active RFID tags

2011 ◽  
Vol 53 (6) ◽  
pp. 1280-1284
Author(s):  
Wei-Jun Wu ◽  
Ying-Zeng Yin ◽  
Yong Huang ◽  
Jie Wang ◽  
Zhi-Ya Zhang
Keyword(s):  
Patch Antenna ◽  
Rfid Tags ◽  
Active Rfid

Active RFID for Enhanced Railway Operations

2010 ◽  
Author(s):  
Ashwin Amanna ◽  
Ambuj Agrawal ◽  
Majid Manteghi
Keyword(s):  
Inventory Management ◽  
Power Source ◽  
Transmission Range ◽  
Rfid Tags ◽  
Rfid Technology ◽  
Active Rfid ◽  
Data Packets ◽  
Advantages And Disadvantages ◽  
Railway Operations ◽  
Passive Rfid

RFID tags have been used by railways for many years, RFID has proven its worth in inventory management, yet this technology is underutilized for enhancing railway operations and health monitoring due to limitations of passive RFID technology. Active RFID provides enhanced capabilities with potential to improve railway operations. Active technology differs from passive RFID by incorporating an onboard power source enabling longer ranges, changeable data fields, and the ability to transmit independently of the reader. This paper compares the advantages and disadvantages of active compared to passive RFID in terms of power requirements, transmission range, and dynamic data. A survey of existing products and vendors is presented. The existing active RFID standards are reviewed and elements of the data tag protocols are detailed as well as protocols for mitigating collisions of data packets. Finally, specific railway applications utilizing active RFID are discussed.

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