Large-scale synthesis of Ag nanoparticles by polyol process for low temperature bonding application

2011 ◽  
Author(s):  
Jianfeng Yan ◽  
Guisheng Zou ◽  
Xiaoyu Wang ◽  
Hailin Bai ◽  
Fengwen Mu ◽  
...  
Keyword(s):  
Low Temperature ◽  
Ag Nanoparticles ◽  
Large Scale ◽  
Polyol Process ◽  
Large Scale Synthesis ◽  
Low Temperature Bonding

Large-Scale Synthesis of Fe3O4Nanosheets at Low Temperature

2007 ◽  
Vol 111 (26) ◽  
pp. 9136-9141 ◽  
Author(s):  
Kok Chung Chin ◽  
Ghee Lee Chong ◽  
Chee Kok Poh ◽  
Li Hui Van ◽  
Chorng Haur Sow ◽  
...  
Keyword(s):  
Low Temperature ◽  
Large Scale ◽  
Large Scale Synthesis

Low Temperature Sintering Bonding Process Using Ag Nanoparticles Derived from Ag2O for Packaging of High-Temperature Electronics

2012 ◽  
Vol 706-709 ◽  
pp. 2962-2967 ◽  
Author(s):  
Akio Hirose ◽  
Naoya Takeda ◽  
Yosuke Konaka ◽  
Hiroaki Tatsumi ◽  
Yusuke Akada ◽  
...  
Keyword(s):  
Low Temperature ◽  
Ag Nanoparticles ◽  
Electronics Packaging ◽  
Bonding Process ◽  
Low Temperature Sintering ◽  
High Melting Point ◽  
Organic Nanoparticles ◽  
High Temperature Electronics ◽  
Low Temperature Bonding

A novel bonding process using Ag2O paste composed of Ag2O particles and a reducing agent has been proposed as a Pb-free alternative of high melting point solders in electronics packaging. Ag2O paste formed Ag nanoparticles through the redox reaction in the bonding process and in-situ formed Ag nanoparticles sintered immediately. While the bonding process using Ag metallo-organic nanoparticles, which have been proposed, was unfavorable to the bonding at 250 degree Celsius or lower in terms of requiring removal of stable organic shells, the bonding process using Ag2O paste demonstrated the possibility of further low-temperature bonding.

Low Temperature Cu–Cu Bonding Technology in Three-Dimensional Integration: An Extensive Review

2018 ◽  
Vol 140 (1) ◽  
Author(s):  
Asisa Kumar Panigrahy ◽  
Kuan-Neng Chen
Keyword(s):  
Low Temperature ◽  
Integrated Circuit ◽  
Large Scale ◽  
Three Dimensional ◽  
3D Ic ◽  
Bonding Technology ◽  
Three Dimensional Integrated Circuit ◽  
Low Temperature Bonding ◽  
Cu Bonding

Arguably, the integrated circuit (IC) industry has received robust scientific and technological attention due to the ultra-small and extremely fast transistors since past four decades that consents to Moore's law. The introduction of new interconnect materials as well as innovative architectures has aided for large-scale miniaturization of devices, but their contributions were limited. Thus, the focus has shifted toward the development of new integration approaches that reduce the interconnect delays which has been achieved successfully by three-dimensional integrated circuit (3D IC). At this juncture, semiconductor industries utilize Cu–Cu bonding as a key technique for 3D IC integration. This review paper focuses on the key role of low temperature Cu–Cu bonding, renaissance of the low temperature bonding, and current research trends to achieve low temperature Cu–Cu bonding for 3D IC and heterogeneous integration applications.

Large-scale synthesis of α-LiFeO2 nanorods by low-temperature molten salt synthesis (MSS) method

2004 ◽  
Vol 265 (1-2) ◽  
pp. 220-223 ◽  
Author(s):  
Xiong Wang ◽  
Lisheng Gao ◽  
Fu Zhou ◽  
Zude Zhang ◽  
Mingrong Ji ◽  
...  
Keyword(s):  
Low Temperature ◽  
Molten Salt ◽  
Large Scale ◽  
Molten Salt Synthesis ◽  
Large Scale Synthesis
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