Finite element analysis of micro-scale CSP solder joint in 3D packaging under random vibration

2017 ◽  
Author(s):  
Li-shuai Han ◽  
Chun-yue Huang ◽  
Rui Yin ◽  
Liang Ying ◽  
Gen-xin Huang ◽  
...  
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Solder Joint ◽  
Random Vibration ◽  
Element Analysis ◽  
Micro Scale ◽  
3D Packaging

Micro-scale finite element analysis of stress concentrations in steel fiber composites under transverse loading

2014 ◽  
Vol 49 (9) ◽  
pp. 1057-1069 ◽  
Author(s):  
Baris Sabuncuoglu ◽  
Svetlana Orlova ◽  
Larissa Gorbatikh ◽  
Stepan V Lomov ◽  
Ignaas Verpoest
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Steel Fiber ◽  
Fiber Composites ◽  
Transverse Loading ◽  
Stress Concentrations ◽  
Element Analysis ◽  
Micro Scale

Finite-element analysis of solder joint strength in laser diode packaging

2000 ◽  
Author(s):  
Chi-Hsiung Chang ◽  
Maw-Tyan Sheen ◽  
Jao-Hwa Kuang ◽  
Chi-Chen Chen ◽  
Gol-Lin Wang ◽  
...  
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Solder Joint ◽  
Laser Diode ◽  
Joint Strength ◽  
Element Analysis
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