Method of fault analysis on typical hybrid Integrated circuit based on nondestructive testing technology

2017 ◽  
Author(s):  
Tao Chen ◽  
Jingming Fei ◽  
Xiaofeng Sun ◽  
Kun Guo ◽  
Nana Rong ◽  
...  
Keyword(s):  
Nondestructive Testing ◽  
Integrated Circuit ◽  
Fault Analysis ◽  
Hybrid Integrated Circuit ◽  
Testing Technology

Three Dimensional Detection of the via in the PCB CT Image Using Morphology Operation

2015 ◽  
Vol 752-753 ◽  
pp. 1406-1412
Author(s):  
Lei Zeng ◽  
Jian Chen ◽  
Han Ning Li ◽  
Bin Yan ◽  
Yi Fu Xu ◽  
...  
Keyword(s):  
Nondestructive Testing ◽  
Printed Circuit Board ◽  
Three Dimensional ◽  
Detection Algorithm ◽  
Circuit Board ◽  
Dimensional Structure ◽  
Three Dimension ◽  
Shape Information ◽  
Printed Circuit ◽  
Testing Technology

In modern industry, the nondestructive testing of printed circuit board (PCB) can prevent effectively the system failure and is becoming more and more important. As a vital part of the PCB, the via connects the devices, the components and the wires and plays a very important role for the connection of the circuits. With the development of testing technology, the nondestructive testing of the via extends from two dimension to three dimension in recent years. This paper proposes a three dimensional detection algorithm using morphology method to test the via. The proposed algorithm takes full advantage of the three dimensional structure and shape information of the via. We have used the proposed method to detect via from PCB images with different size and quality, and found the detection performances to be very encouraging.

scholarly journals Screen Printing Strategy for Investigation of Spectrophotometric Properties of Modified Thick Films of Zirconium Oxide (ZrO2): Tin Oxide (SnO2) Composites

2021 ◽  
Vol 37 (5) ◽  
pp. 1117-1124
Author(s):  
R. M. Nikam ◽  
A. P. Patil ◽  
K. H. Kapadnis ◽  
A. D. Ahirrao ◽  
R.Y. Borse
Keyword(s):  
Tin Oxide ◽  
Integrated Circuit ◽  
Zirconium Oxide ◽  
Screen Printing ◽  
Thick Films ◽  
Ultra Violet ◽  
Spectrophotometric Study ◽  
X Ray Diffraction ◽  
X Ray ◽  
Hybrid Integrated Circuit

There are numerous methods has been investigated and developed for the preparation of thin and thick films. Thick film technology is utilized for the production of electronic devices like surface mount devices, in the preparation of hybrid integrated circuit, in the formulation of heating elements, in the construction of integrated passive devices and sensors. Pure tin oxide (SnO2) and composite 1%, 3%, 5%, 7% and 9 % zirconium oxide (ZrO2) thick films of dimensions 2 cm×1 cm incorporated into pure tin oxide (SnO2) were prepared with standard screen printing method. All samples were fabricated on glass support. The thick films were subjected to drying and firing at 5000C at 5 hours in muffle furnace. Thick films of tin oxide (SnO2) and composite 1%, 3%, 5%, 7% and 9 % zirconium oxide (ZrO2) incorporated into pure tin oxide (SnO2) were checked for Scanning Electron Microscopy (S.E.M), Energy Dispersive X-ray Spectroscopy (E.D.A.X), X-ray diffraction (X.R.D), Fourier Transform infra-Red (F.T.I.R) and Ultra-Violet-Visible spectroscopy (U.V) for surface morphology, elemental analysis, crystalline phases of films, vibrational and spectrophotometric study respectively. In this research paper the spectrophotometric parameters such as absorbance and absorption coefficient with pure and compositional thick films were a part of investigation and surveillance.

Separation of Internal Strains and Lattice Distortion Caused by Oxygen Impurities in Aluminum Nitride Hot-Pressed Ceramics

1994 ◽  
Vol 38 ◽  
pp. 479-487 ◽  
Author(s):  
O. N. Grigoriev ◽  
S. M. Kushnerenko ◽  
K. A. Plotnikov ◽  
W. Kreher
Keyword(s):  
Thermal Conductivity ◽  
Aluminum Nitride ◽  
Integrated Circuit ◽  
Room Temperature ◽  
Lattice Distortion ◽  
High Thermal Conductivity ◽  
Hybrid Integrated Circuit ◽  
Oxygen Contamination ◽  
Internal Strains ◽  
Oxygen Impurities

Recently aluminum nitride (A1N) has been intensively studied as a promising material for production of hybrid integrated circuit substrates because of its high thermal conductivity, high fjexural strength, and nontoxic nature. The estimated theoretical value of its thermal conductivity at room temperature is 320 W/mK, but it is strongly degraded by the introduction of oxygen. The measured values vary from 30 to 260 W/mK, Therefore, in production of this material the reduction of oxygen contamination is of paramount importance.

Application of Nondestructive Testing in Bridge Structure Quality Detection

2011 ◽  
Vol 66-68 ◽  
pp. 1122-1125
Author(s):  
Jing Xi Chen ◽  
Li Yuan ◽  
Guang Zhang
Keyword(s):  
Nondestructive Testing ◽  
Electromagnetic Induction ◽  
Bridge Structure ◽  
Induction Method ◽  
Actual Measurement ◽  
Structure Quality ◽  
Advantages And Disadvantages ◽  
Quality Detection ◽  
Testing Technology

This paper discusses recent nondestructive testing technology in the application of bridge structure, which focus on common rebound method and electromagnetic induction method. According to the actual measurement problems, the article explains the rebound method and electromagnetic induction method including their advantages and disadvantages, and puts forward the method of avoiding problems.

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