Effect of Power on the Hollow Phenomenon during Laser Sintering of Copper Nanoparticles

2020 ◽  
Author(s):  
Shaogen Luo ◽  
Guannan Yang ◽  
Guangdong Xu ◽  
Chengqiang Cui ◽  
Yu Zhang
Keyword(s):  
Copper Nanoparticles ◽  
Laser Sintering

Laser Sintering of Copper Nanoparticles: A Simplified Model for Fluence Estimation and Validation

2017 ◽  
Author(s):  
Nilabh Roy ◽  
William Jou ◽  
He Feng ◽  
Jihoon Jeong ◽  
Yaguo Wang ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Copper Nanoparticles ◽  
Integrated Circuit ◽  
Laser Sintering ◽  
Simplified Model ◽  
Flexible Substrates ◽  
Copper Nanoparticle ◽  
Pulsed Lasers ◽  
Low Resistivity ◽  
Rc Delay

Copper (Cu) has already replaced aluminum as the primary material for interconnect fabrication due to its superior electrical and thermal conductivity. Low resistivity of Cu decreases the RC delay which in turn increases the integrated circuit (IC) speed. Copper nanoparticle (NP) inks can also serve as a promising replacement of silver NP inks in 2D printing applications on solid and flexible substrates. This paper presents a simplified model to estimate optimum laser sintering parameters of Cu NPs. The model is validated by the experimental sintering results using nanosecond and femtosecond pulsed lasers. The predicted sintering thresholds agree well with sintering experiments.

Laser sintering of copper nanoparticles

2013 ◽  
Vol 47 (2) ◽  
pp. 025501 ◽  
Author(s):  
Michael Zenou ◽  
Oleg Ermak ◽  
Amir Saar ◽  
Zvi Kotler
Keyword(s):  
Copper Nanoparticles ◽  
Laser Sintering

scholarly journals Laser sintering of copper nanoparticles on top of silicon substrates

2015 ◽  
Vol 27 (3) ◽  
pp. 035203 ◽  
Author(s):  
A Soltani ◽  
B Khorramdel Vahed ◽  
A Mardoukhi ◽  
M Mäntysalo
Keyword(s):  
Copper Nanoparticles ◽  
Laser Sintering ◽  
Silicon Substrates

scholarly journals Laser sintering of oxidized copper nanoparticles deposited by dry aerosol printing

2021 ◽  
Vol 2086 (1) ◽  
pp. 012019
Author(s):  
D V Kornyushin ◽  
A A Efimov ◽  
A I Buchnev ◽  
E I Kameneva ◽  
V V Ivanov
Keyword(s):  
Laser Radiation ◽  
Copper Nanoparticles ◽  
Electrical Resistance ◽  
Local Treatment ◽  
Laser Sintering ◽  
Specific Electrical Resistance ◽  
Aerosol Printing ◽  
Aerosol Jets ◽  
Semiconductor Arrays ◽  
Nanoparticle Sizes

Abstract Sintering of oxidized copper nanoparticles arrays in the form of lines by the local treatment of laser radiation with wavelengths of 527 nm and 980 nm was studied. To form lines with a width equal to 40–150 μm and a thickness equal to 0.5–4 μm focused aerosol jets with average nanoparticle sizes of 110 and 65 nm were used. The production of semiconductor arrays from oxidized copper nanoparticles with a specific electrical resistance of 2⋅10−3 Ω⋅m using laser radiation with a wavelength of 980 nm was demonstrated.

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