Effect of an air layer on the insulation performance at the interface between epoxy resin and silicone rubber

Author(s):  
K. Shibata ◽  
Y. Ohki ◽  
T. Takahashi ◽  
T. Okamoto
Author(s):  
Fangcheng Lü ◽  
Pin Lü ◽  
Haoou Ruan ◽  
Shuangshuang Wang ◽  
Shuaitao Mao ◽  
...  

2017 ◽  
Vol 53 (2) ◽  
pp. 1167-1177 ◽  
Author(s):  
Xiongwei Zhao ◽  
Chongguang Zang ◽  
Yalun Sun ◽  
Kaiguo Liu ◽  
Yuquan Wen ◽  
...  

2015 ◽  
Vol 1119 ◽  
pp. 769-774
Author(s):  
Nutsopin Nilbunpot ◽  
Amnart Suksri

Surface tracking is one of the causes that degraded the property of cable spacer. This research investigates about the mechanical stress and surface tracking performance of 22 kV cable spacer. Sample were tested according to the surface tracking under IEC 60587 standard under modified condition by and addition of the mechanical weight on the surface of pure epoxy resin sample. The mechanical load use were 0 kg and increase from 5 kg until 15 kg. The results showed that mechanical stress has affected the surface degradation of an insulation performance when the mechanical load is increased combined with high electrical field.


2017 ◽  
Vol 15 (1_suppl) ◽  
pp. 38-44 ◽  
Author(s):  
Chao Zhong ◽  
Likun Wang ◽  
Lei Qin ◽  
Yanjun Zhang

Introduction To increase electromechanical coupling factor of 1-3 piezoelectric composite and reduce its bending deformation under external stress, an improved 1-3 piezoelectric composite is developed. In the improved structure, both epoxy resin and silicone rubber are used as polymer material. Methods The simulation model of the improved 1-3 piezoelectric composite was established using the finite element software ANSYS. The relationship of the performance of the improved composite to the volume percentage of silicone rubber was determined by harmonic response analysis and the bending deformation under external stress was simulated by static analysis. The improved composite samples were prepared by cutting and filling methods, and the performance was tested. Results The feasibility of the improved structure was verified by finite element simulation and experiment. The electromechanical coupling factor of the improved composite can reach 0.67 and meanwhile the characteristic impedance can decline to 13 MRayl. The electromechanical coupling factor of the improved composite is higher than that of the composite with only epoxy resin as the polymer and the improved composite can reduce bending deformation. Discussion Comparison of simulation and experiment, the results of the experiment are in general agreement with those from the simulation. However, most experimental values were higher than the simulation results, and the abnormality of the test results was also more obvious than that of the simulation. These findings may be attributed to slight difference in the material parameters of simulation and experiment.


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