Breakdown strength at the interface between epoxy resin and silicone rubber - A basic study for the development of all solid insulation -

2005 ◽  
Vol 12 (4) ◽  
pp. 719-724 ◽  
Author(s):  
T. Takahashi ◽  
T. Okamoto ◽  
Y. Ohki ◽  
K. Shibata
Keyword(s):  
Epoxy Resin ◽  
Silicone Rubber ◽  
Breakdown Strength ◽  
Basic Study ◽  
Solid Insulation

scholarly journals Improvement of DC Breakdown Strength of the Epoxy/POSS Nanocomposite by Tailoring Interfacial Electron Trap Characteristics

Materials ◽  
2021 ◽  
Vol 14 (5) ◽  
pp. 1298
Author(s):  
Farooq Aslam ◽  
Zhen Li ◽  
Guanghao Qu ◽  
Yang Feng ◽  
Shijun Li ◽  
...  
Keyword(s):  
Epoxy Resin ◽  
Breakdown Voltage ◽  
Breakdown Strength ◽  
Deep Level ◽  
Simulation Method ◽  
Neat Epoxy ◽  
Interfacial Region ◽  
Chemical Calculation ◽  
Oligomeric Silsesquioxane ◽  
Underlying Risk

To date, breakdown voltage is an underlying risk to the epoxy-based electrical high voltage (HV) equipment. To improve the breakdown strength of epoxy resin and to explore the formation of charge traps, in this study, two types of polyhedral oligomeric silsesquioxane (POSS) fillers are doped into epoxy resin. The breakdown voltage test is performed to investigate the breakdown strength of neat epoxy and epoxy/POSS composites. Electron traps that play an important role in breakdown strength are characterized by thermally stimulated depolarized current (TSDC) measurement. A quantum chemical calculation tool identifies the source of traps. It is found that adding octa-glycidyl POSS (OG-POSS) to epoxy enhances the breakdown strength than that of neat epoxy and epoxycyclohexyl POSS (ECH-POSS) incorporated epoxy. Moreover, side groups of OG-POSS possess higher electron affinity (EA) and large electronegativity that introduces deep-level traps into epoxy resin and restrain the electron transport. In this work, the origin of traps has been investigated by the simulation method. It is revealed that the functional properties of POSS side group can tailor an extensive network of deep traps in the interfacial region with epoxy and enhance the breakdown strength of the epoxy/POSS nanocomposite.

scholarly journals Basic Study for Application of Solid Insulation System to D.C. Superconducting Cable

2003 ◽  
Vol 38 (4) ◽  
pp. 147-151
Author(s):  
Atsushi MINODA ◽  
Yuji MURAMOTO ◽  
Yukio MIZUNO ◽  
Masayuki NAGAO ◽  
Masamitsu KOSAKI
Keyword(s):  
Insulation System ◽  
Basic Study ◽  
Solid Insulation

Borosiloxane oligomers for improving adhesion of addition-curable liquid silicone rubber with epoxy resin by surface treatment

2017 ◽  
Vol 53 (2) ◽  
pp. 1167-1177 ◽  
Author(s):  
Xiongwei Zhao ◽  
Chongguang Zang ◽  
Yalun Sun ◽  
Kaiguo Liu ◽  
Yuquan Wen ◽  
...  
Keyword(s):  
Surface Treatment ◽  
Epoxy Resin ◽  
Silicone Rubber ◽  
Liquid Silicone Rubber ◽  
Liquid Silicone

Filler concentration effect on breakdown strength and trap level of epoxy resin–Al2O3 nanocomposites

2020 ◽  
Author(s):  
Muhammad Zeeshan khan ◽  
Feipeng Wang ◽  
Aashir Waleed ◽  
Zhengyong Huang ◽  
Muhammad Arshad Shehzad Hassan ◽  
...  
Keyword(s):  
Epoxy Resin ◽  
Breakdown Strength ◽  
Concentration Effect ◽  
Filler Concentration ◽  
Trap Level

Characterization of an Improved 1-3 Piezoelectric Composite by Simulation and Experiment

2017 ◽  
Vol 15 (1_suppl) ◽  
pp. 38-44 ◽  
Author(s):  
Chao Zhong ◽  
Likun Wang ◽  
Lei Qin ◽  
Yanjun Zhang
Keyword(s):  
Finite Element ◽  
Epoxy Resin ◽  
Silicone Rubber ◽  
Electromechanical Coupling ◽  
Electromechanical Coupling Factor ◽  
Coupling Factor ◽  
External Stress ◽  
Piezoelectric Composite ◽  
Bending Deformation ◽  
Simulation And Experiment

Introduction To increase electromechanical coupling factor of 1-3 piezoelectric composite and reduce its bending deformation under external stress, an improved 1-3 piezoelectric composite is developed. In the improved structure, both epoxy resin and silicone rubber are used as polymer material. Methods The simulation model of the improved 1-3 piezoelectric composite was established using the finite element software ANSYS. The relationship of the performance of the improved composite to the volume percentage of silicone rubber was determined by harmonic response analysis and the bending deformation under external stress was simulated by static analysis. The improved composite samples were prepared by cutting and filling methods, and the performance was tested. Results The feasibility of the improved structure was verified by finite element simulation and experiment. The electromechanical coupling factor of the improved composite can reach 0.67 and meanwhile the characteristic impedance can decline to 13 MRayl. The electromechanical coupling factor of the improved composite is higher than that of the composite with only epoxy resin as the polymer and the improved composite can reduce bending deformation. Discussion Comparison of simulation and experiment, the results of the experiment are in general agreement with those from the simulation. However, most experimental values were higher than the simulation results, and the abnormality of the test results was also more obvious than that of the simulation. These findings may be attributed to slight difference in the material parameters of simulation and experiment.

scholarly journals Improved thermal conductivity and AC dielectric breakdown strength of silicone rubber/BN composites

2020 ◽  
Vol 2 ◽  
pp. 100023
Author(s):  
Maryam Sarkarat ◽  
Michael Lanagan ◽  
Dipankar Ghosh ◽  
Andrew Lottes ◽  
Kent Budd ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Silicone Rubber ◽  
Dielectric Breakdown ◽  
Breakdown Strength ◽  
Dielectric Breakdown Strength
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