Microelectronic packaging trends: Materials and Processes

2005 ◽  
Author(s):  
W.T. Chen ◽  
S.K. Lahiri
Keyword(s):  
Microelectronic Packaging

Research of LTCC/Cu, Ag multilayer substrate in microelectronic packaging

2002 ◽  
Vol 94 (1) ◽  
pp. 48-53 ◽  
Author(s):  
Yonggang Wang ◽  
Guangneng Zhang ◽  
Jusheng Ma
Keyword(s):  
Microelectronic Packaging ◽  
Multilayer Substrate

Quality Monitoring and Prospects of Wire Bonding

2012 ◽  
Vol 588-589 ◽  
pp. 1156-1160
Author(s):  
Ge Ge Mei ◽  
Bin Jin ◽  
Wei Gong
Keyword(s):  
Process Parameters ◽  
Wire Bonding ◽  
Quality Monitoring ◽  
Main Trend ◽  
Microelectronic Packaging ◽  
Main Process ◽  
Bonding Quality ◽  
Semiconductor Packaging

Wire bonding is rapidly developmental technology of microelectronic packaging nearly half a century and become the main trend of semiconductor packaging field currently. This article introduces the main process parameters influencing on bonding quality, the methods to improve the bonding reliability, and prospects of developmental tendency of wire bonding.

scholarly journals Design and Development of Stress-Engineered Compliant Interconnect for Microelectronic Packaging

Nanopackaging ◽  
2018 ◽  
pp. 867-891
Author(s):  
Lunyu Ma ◽  
Suresh K. Sitaraman ◽  
Qi Zhu ◽  
Kevin Klein ◽  
David Fork
Keyword(s):  
Microelectronic Packaging ◽  
Design And Development ◽  
Compliant Interconnect

Thin Film Adhesion Study in Microelectronic Packaging

1991 ◽  
Vol 239 ◽  
Author(s):  
H. S. Jeong ◽  
Y. Z. Chu ◽  
M. B. Freiler ◽  
C. Durning ◽  
R. C. White
Keyword(s):  
Thin Film ◽  
Thin Film Deposition ◽  
Film Deposition ◽  
Microelectronic Packaging ◽  
Elastic Model ◽  
Blister Test ◽  
Linear Elastic ◽  
Film Adhesion ◽  
Thin Film Adhesion ◽  
Cure Temperature

ABSTRACTFracture energy (Ga) of BPDA-PDA polyimide (PI) on modified and unmodified Si surfaces was measured by the “blister” test as a function of final cure temperature. It is proven quantitatively that surface modification prior to thin film deposition enhances adhesion. Metal adhesion to PI was also measured by the same method. Reproducibility of the data was found to be exceptionally good for both cases. The linear elastic model is quite valid for the test of thin film adhesion. Therefore, it is believed that this test is best suited for Ga measurements in the study of thin film adhesion for microelectronic packaging.

scholarly journals Morphology Evaluation of Microelectronic Packaging Substrates Using Shadow Moiré Technique

IEEE Access ◽  
2018 ◽  
Vol 6 ◽  
pp. 33099-33110
Author(s):  
Fulong Zhu ◽  
Xinxin Lin ◽  
Wei Zhang ◽  
Jiajie Fan ◽  
Sheng Liu
Keyword(s):  
Microelectronic Packaging ◽  
Shadow Moire ◽  
Shadow Moiré
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