Most promising metal-to-metal antifuse based 10 nm-thick p-SiN/sub x/ film for high density and high speed FPGA application
2007 ◽
Vol 127
(10)
◽
pp. 1033-1042
Keyword(s):
1993 ◽
Vol 16
(4)
◽
pp. 384-387
◽
Keyword(s):