Energy dependence of transient-enhanced-diffusion in low energy high dose arsenic implants in silicon

Author(s):  
V. Krishnamoorthy ◽  
B. Beaudet ◽  
K.S. Jones ◽  
D. Venables
1998 ◽  
Vol 84 (11) ◽  
pp. 5997-6002 ◽  
Author(s):  
V. Krishnamoorthy ◽  
K. Moller ◽  
K. S. Jones ◽  
D. Venables ◽  
J. Jackson ◽  
...  

2002 ◽  
Vol 717 ◽  
Author(s):  
Masashi Uematsu

AbstractThe transient enhanced diffusion (TED) of high-dose implanted P is simulated taking into account Ostwald ripening of end-of-range (EOR) defects. First, we integrated a basic diffusion model based on the simulation of in-diffusion, where no implanted damages are involved. Second, from low-dose implantation, we developed a model for TED due to {311} self-interstitial (I) clusters involving Ostwald ripening and the dissolution of {311} clusters. Third, from medium-dose implantation, we showed that P-I clusters should be taken into account, and during the diffusion, the clusters are dissolved to emit self-interstitials that also contribute to TED. Finally, from high-dose implantation, EOR defects are modeled and we derived a formula to describe the time-dependence for Ostwald ripening of EOR defects, which is more significant at higher temperatures and longer annealing times. The simulation satisfactorily predicts the TED for annealing conditions, where the calculations overestimate the diffusion without taking Ostwald ripening into account.


1997 ◽  
Vol 469 ◽  
Author(s):  
N. E. B. Cowern ◽  
E. J. H. Collart ◽  
J. Politiek ◽  
P. H. L. Bancken ◽  
J. G. M. Van Berkum ◽  
...  

ABSTRACTLow energy implantation is currently the most promising option for shallow junction formation in the next generations of silicon CMOS technology. Of the dopants that have to be implanted, boron is the most problematic because of its low stopping power (large penetration depth) and its tendency to undergo transient enhanced diffusion and clustering during thermal activation. This paper reports recent advances in our understanding of low energy B implants in crystalline silicon. In general, satisfactory source-drain junction depths and sheet resistances are achievable down to 0.18 micron CMOS technology without the need for implantation of molecular species such as BF2. With the help of defect engineering it may be possible to reach smaller device dimensions. However, there are some major surprises in the physical mechanisms involved in implant profile formation, transient enhanced diffusion and electrical activation of these implants, which may influence further progress with this technology. Some initial attempts to understand and model these effects will be described.


1995 ◽  
Vol 67 (14) ◽  
pp. 2025-2027 ◽  
Author(s):  
L. H. Zhang ◽  
K. S. Jones ◽  
P. H. Chi ◽  
D. S. Simons

1998 ◽  
Vol 54 (1-3) ◽  
pp. 80-83 ◽  
Author(s):  
Norihiro Shimada ◽  
Takaaki Aoki ◽  
Jiro Matsuo ◽  
Isao Yamada ◽  
Kenichi Goto ◽  
...  

2000 ◽  
Vol 77 (1) ◽  
pp. 112-114 ◽  
Author(s):  
Hugo Saleh ◽  
Mark E. Law ◽  
Sushil Bharatan ◽  
Kevin S. Jones ◽  
Viswanath Krishnamoorthy ◽  
...  

2000 ◽  
Vol 610 ◽  
Author(s):  
E. Napolitani ◽  
A. Carnera ◽  
V. Privitera ◽  
E. Schroer ◽  
G. Mannino ◽  
...  

AbstractThe transient enhanced diffusion (TED) during activation annealing of ultra low energy implanted boron (0.5 keV & 1 keV, 1×1013/cm2 & 1×1014/cm2) in silicon is investigated in detail. Annealing in the temperature range from 450°C to 750°C is either performed directly after implantation or after the removal of a surface layer before annealing. The kinetics revealed two regimes of enhanced diffusion ruled by different decay constants and different activation energies. The dependence of these two processes on implantation energy and annealing temperature is described and explained from the microscopical point of view. The annealings performed after surface layer removal, revealed that the defects responsible for the faster diffusion are located deeper than the defects responsible for the slower process.


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