E-test Probe Mark Topology-induced Failure

Author(s):  
Jf Jong ◽  
Tw Lim ◽  
Sh Goh ◽  
Yang Qu ◽  
Jeffrey Lam
Keyword(s):  
2001 ◽  
Vol 549 (1) ◽  
pp. L15-L19 ◽  
Author(s):  
Kazuhiro Yamamoto ◽  
Hiroaki Nishioka
Keyword(s):  

1986 ◽  
Vol 26 (4) ◽  
pp. 801
Author(s):  
LouisH Faure ◽  
DanaR Townsend ◽  
ThomasJ Walsh
Keyword(s):  

2018 ◽  
Vol 2018 ◽  
pp. 1-8 ◽  
Author(s):  
Xiaohua Ma ◽  
Guoguang Wu ◽  
Yuehua Zhao ◽  
Zibo Yuan ◽  
Yu Zhang ◽  
...  

We reported here a turn-on fluorescent probe (1) for the detection of cysteine (Cys) by incorporating the recognition unit of 2,4-dinitrobenzenesulfonyl ester (DNBS) to a coumarin derivative. The structure of the obtained probe was confirmed by NMR and HRMS techniques. The probe shows a remarkable fluorescence off-on response (∼52-fold) by the reaction with Cys in 100% aqueous buffer. The sensing mechanism was verified by the HPLC test. Probe 1 also displays high selectivity towards Cys. The detection limit was calculated to be 23 nM. Moreover, cellular experiments demonstrated that the probe is highly biocompatible and can be used for monitoring intracellular Cys.


2016 ◽  
Vol 90 (9-12) ◽  
pp. 2839-2847 ◽  
Author(s):  
Augusto Carreon ◽  
Arturo Baltazar ◽  
Chidentree Treesatayapun

2009 ◽  
Vol 44 (9) ◽  
pp. 1067-1075 ◽  
Author(s):  
Erika Sugiyama ◽  
Makoto Inada ◽  
Jun-Ichi Kunizaki ◽  
Kazuki Tobita ◽  
Takahito Yoshida ◽  
...  

1979 ◽  
Vol 66 (5) ◽  
pp. 1579-1579
Author(s):  
Adrian R. Kerouac
Keyword(s):  

2009 ◽  
Vol 83-86 ◽  
pp. 1228-1235 ◽  
Author(s):  
Shankargoud Nyamannavar ◽  
K. Narayan Prabhu

The success of a numerical simulation for solder solidification during soldering processes depends on an accurate knowledge of heat transfer phenomenon at the solder/substrate interface. Two experimental setups were designed to study the interfacial heat transfer at solder/substrate interface. In the first method, a cylindrical probe of substrate material was dipped in liquid solder and solder was allowed to solidify around the metal probe. In the second method the test probe was dipped in the bulk solder liquid of sufficiently large quantity and allowed to attain the surrounding solder liquid temperature. Temperature at the center of the probe was measured using thermocouple. Heat flux transients at the surface of the probe were estimated by lumped heat capacitance method. SEM study at the solder/substrate interfacial region for experiments of solidifying solder around the test probe revealed the existence of a clear gap with aluminum substrate. A conforming contact was obtained with copper substrate. The nature of heat flux transients was found to be different in two experiments.


1990 ◽  
Vol 112 (1) ◽  
pp. 75-77
Author(s):  
E. Suhir ◽  
W. E. Benedetto

The study contains a theoretical and experimental evaluation of the mechanical behavior of wires in a flexible (“Euler”) test probe, including buckling, axial and lateral deflections and stresses. The developed formulas are simple, easy-to-use and clearly indicate the role of the major factors affecting the wire performance. Calculations, executed for an Everett-Charles 32 point probe, are in good agreement with the measured data. Some recommendations for smaller stresses in the wires are presented. The obtained results could be of help in the analysis and physical design of “Euler” test probes.


AORN Journal ◽  
1993 ◽  
Vol 58 (3) ◽  
pp. 573-574
Author(s):  
LYNNETTE B. GANGLOFF
Keyword(s):  

Sign in / Sign up

Export Citation Format

Share Document