Experimental Models for Assessment of Interfacial Heat Transfer in Dip Soldering

2009 ◽  
Vol 83-86 ◽  
pp. 1228-1235 ◽  
Author(s):  
Shankargoud Nyamannavar ◽  
K. Narayan Prabhu
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Copper Substrate ◽  
Substrate Material ◽  
Experimental Models ◽  
Bulk Solder ◽  
Interfacial Region ◽  
Interfacial Heat Transfer ◽  
Test Probe ◽  
Substrate Interface

The success of a numerical simulation for solder solidification during soldering processes depends on an accurate knowledge of heat transfer phenomenon at the solder/substrate interface. Two experimental setups were designed to study the interfacial heat transfer at solder/substrate interface. In the first method, a cylindrical probe of substrate material was dipped in liquid solder and solder was allowed to solidify around the metal probe. In the second method the test probe was dipped in the bulk solder liquid of sufficiently large quantity and allowed to attain the surrounding solder liquid temperature. Temperature at the center of the probe was measured using thermocouple. Heat flux transients at the surface of the probe were estimated by lumped heat capacitance method. SEM study at the solder/substrate interfacial region for experiments of solidifying solder around the test probe revealed the existence of a clear gap with aluminum substrate. A conforming contact was obtained with copper substrate. The nature of heat flux transients was found to be different in two experiments.

Performance Comparison of Microchannel Heat Sink Using Boron-Based Ceramic Materials

2021 ◽  
Vol 1163 ◽  
pp. 73-88
Author(s):  
Md Tanbir Sarowar
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Heat Sink ◽  
Electronic Devices ◽  
Ceramic Materials ◽  
Substrate Material ◽  
Heat Sinks ◽  
Maximum Temperature ◽  
Microchannel Heat Sink ◽  
Small Surface

Microchannel heat sink plays a vital role in removing a considerable amount of heat flux from a small surface area from different electronic devices. In recent times, the rapid development of electronic devices requires the improvement of these heat sinks to a greater extent. In this aspect, the selection of appropriate substrate materials of the heat sinks is of vital importance. In this paper, three boron-based ultra-high temperature ceramic materials (ZrB2, TiB2, and HfB2) are compared as a substrate material for the microchannel heat sink using a numerical approach. The fluid flow and heat transfer are analyzed using the finite volume method. The results showed that the maximum temperature of the heat source didn’t exceed 355K at 3.6MWm-2 for any material. The results also indicated HfB2 and TiB2 to be more useful as a substrate material than ZrB2. By applying 3.6 MWm-2 heat flux at the source, the maximum obtained surface heat transfer coefficient was 175.2 KWm-2K-1 in a heat sink having substrate material HfB2.

scholarly journals Wetting layer evolution and interfacial heat transfer in water-air spray cooling process of hot metallic surface

2021 ◽  
pp. 318-318
Author(s):  
Lidan Ning ◽  
Liping Zou ◽  
Zhichao Li ◽  
Huiping Li
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Nucleate Boiling ◽  
Spray Cooling ◽  
Film Boiling ◽  
Metallic Surface ◽  
Interfacial Heat Transfer Coefficient ◽  
Interfacial Heat Transfer ◽  
Cooling Process ◽  
Inverse Heat Transfer

Spray cooling experiments on the hot metallic surfaces with different initial temperatures were performed. This paper adopts a self-developing program which is based on the inverse heat transfer algorithm to solve the interfacial heat transfer coefficient and heat flux. The temperature-dependent interfacial heat transfer mechanism of water-air spray cooling is explored according to the wetting layer evolution taken by a high-speed camera and the surface cooling curves attained by the inverse heat transfer algorithm. Film boiling, transition boiling, and nucleate boiling stages can be noticed during spray cooling process of hot metallic surface. When the cooled surface?s temperature drops to approximately 369?C - 424?C; the cooling process transfers into the transition boiling stage from the film boiling stage. The wetting regime begins to appear on the cooled surface, the interfacial heat transfer coefficient and heat flux begin to increase significantly. When the cooled surface?s temperature drops to approximately 217?C - 280?C, the cooling process transfers into the nucleate boiling stage. The cooled surface was covered by a liquid film, and the heat flux begins to decrease significantly.

Alternative and Relevant Representation to Heat Transfer Coefficient for Modeling the Heat Transfer Between a Fluid and a Non-Isothermal Wall in Transient Regime

2010 ◽  
Author(s):  
Benjamin Remy ◽  
Alain Degiovanni
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Heat Transfer Coefficient ◽  
Steady State ◽  
Boundary Conditions ◽  
Transfer Coefficient ◽  
Flat Plate ◽  
Temperature Difference ◽  
Interfacial Heat Transfer ◽  
Thermal Boundary Conditions

This paper deals with the relevant model that can be proposed for modeling the interfacial heat transfer between a fluid and a wall in the case of space and time varying thermal boundary conditions. Usually, for a constant and uniform heat transfer (unidirectional steady-state regime), the problem can be solved introducing a heat transfer coefficient h, uniform in space and constant in time that linearly links the surface heat flux and the temperature difference between the wall temperature Tw and an equivalent fluid temperature Tf. The problem we consider in this work concerns the heat transfer between a steady-state fluid flow and a wall submitted to a transient and non uniform thermal solicitations, as for instance a steady-state flow on a flat plate submitted to a transient and space reduced heat flux. We will show that the more interesting representation for describing the interfacial heat transfer is not to define as usually done a non-uniform and variable heat transfer coefficient h(x,t) because as it depends on the thermal boundary conditions, it is not really intrinsic. We propose an alternative approach, which consists in introducing a generalized impedance Z(ω,p) that links in space and time domain the heat flux and the temperature difference through a double convolution product instead of a scalar product. After the presentation of the general problem, the simple case of a stationary piston flow that can be solved analytically will be considered for validation both in thermal steady-state and transient regimes. To conclude and show the interest of our approach, a comparison between a global approach and a numerical simulation in a more complex and realistic case taking into account the thermal coupling with a flat plate will be presented.

scholarly journals Mold–Slug Interfacial Heat Transfer Characteristics of Different Coating Thicknesses: Effects on Slug Temperature and Microstructure in Swirled Enthalpy Equilibration Device Process

Materials ◽  
2019 ◽  
Vol 12 (11) ◽  
pp. 1836
Author(s):  
Min Luo ◽  
Daquan Li ◽  
Wenying Qu ◽  
Xiaogang Hu ◽  
Qiang Zhu ◽  
...  
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Heat Transfer Coefficient ◽  
Transfer Coefficient ◽  
Coating Thickness ◽  
Early Stage ◽  
Dendritic Structure ◽  
Mold Surface ◽  
Interfacial Heat Transfer Coefficient ◽  
Interfacial Heat Transfer

Application of a coating on a mold surface is widely used in the foundry industry. Changes in coating change the heat transfer at the mold–melt interface, which influences the microstructure of the casting. In this study, the effect of boron nitride coating thickness on the interfacial heat transfer and slug microstructure in the Swirled Enthalpy Equilibration Device (SEED) process was investigated. The temperatures of the semi-solid slug and mold were measured, and the interfacial heat transfer coefficient and heat flux of the mold–slug interface was estimated based on these data. Microstructures of the quenched slugs were also examined. The results indicated that the interfacial heat transfer coefficient decreased with an increase in coating thickness and was sensitive to a coating thickness of less than 0.1 mm. The interfacial heat flux decreased sharply at the early stage, and then slowed down as the swirling time increased and the coating thickened. The coating thickness affected the temperature evolution of the slug at the early stage of the SEED process. As the coating thickness increased from near zero to 1.0 mm, the grain size of the slug increased by ~20 µm and the globular structure of the slug transformed into a dendritic structure.

Electrohydrodynamic Conduction Pumping-Driven Liquid Film Flow Boiling on Bare and Nanofiber-Enhanced Surfaces

2015 ◽  
Vol 138 (4) ◽  
Author(s):  
Viral K. Patel ◽  
Jamal Seyed-Yagoobi ◽  
Suman Sinha-Ray ◽  
Sumit Sinha-Ray ◽  
Alexander Yarin
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Liquid Film ◽  
Boiling Heat Transfer ◽  
Film Flow ◽  
Flow Boiling ◽  
Copper Substrate ◽  
Polymer Nanofiber ◽  
Liquid Film Flow ◽  
Bare Surface

Liquid film flow boiling heat transfer driven by electrohydrodynamic (EHD) conduction pumping is experimentally studied on a surface with a novel metal-plated nanofiber-mat coating. The nanotextured surface is formed on a copper substrate covered by an electrospun polymer nanofiber mat, which is copper-plated as a postprocess. The mat has a thickness of about 30 μm and is immersed in saturated HCFC-123. The objective is to study electrowetting of the copper-plated nanofiber-enhanced surface via EHD conduction pumping mechanism for the entire liquid film flow boiling regime leading up to critical heat flux (CHF), and compare it to the bare surface without EHD-driven flow. The results show that with the combination of these two techniques, for a given superheat value, enhancement in heat flux and boiling heat transfer coefficient is as high as 555% compared to the bare surface. The results are quite promising for thermal management applications.

Numerical study of entropy generation and forced convection heat transfer of a nanofluid in a channel with different fin cross-sections

2021 ◽  
Vol ahead-of-print (ahead-of-print) ◽  
Author(s):  
Zahra Sarbazi ◽  
Faramarz Hormozi
Keyword(s):  
Heat Transfer ◽  
Entropy Generation ◽  
Cross Sections ◽  
Heat Sink ◽  
Silicon Oxide ◽  
Numerical Study ◽  
Copper Substrate ◽  
Substrate Material ◽  
Hydrodynamic Performance ◽  
Content Type

Purpose This study aims to numerically investigate the thermal-hydrodynamic performance of silicon oxide/water nanofluid laminar flow in the heat sink miniature channel with different fin cross-sections. The effect of the fin cross-section including semi-circular, rectangular and quadrant in two directions of flat and curved, and channel substrate materials of steel, aluminum, copper and titanium were examined. Finally, the analysis of thermal and frictional entropy generation in different channels is performed. Design/methodology/approach According to the numerical results, the highest heat transfer coefficients belong to the rectangular, quadrant 2, quadrant 1 and semi-circular fins compared to the channel without fin is 38.65%, 29.94%, 27.45% and 17.1%, respectively. Also, the highest performance evaluation criteria belong to the rectangular and quadrant 2 fins, which have 1.35 and 1.29, respectively. Based on the thermal conductivity of the substrate material, the best material is copper. According to the results of entropy analysis, the reduction of thermal irreversibility of the channel with rectangular, quadrant 1, quadrant 2 and semi-circular compared to non-finned channel is equal to 72%, 57%, 63% and 48%, respectively. Findings The rectangular and quadrant 2 fins are the best fins and the copper substrate material is the best material to reduce the entropy generation. Originality/value The silicon oxide/water nanofluid flow in the heat sink miniature channel with various fin shapes and the curvature angle against the fluid flow was simulated to increase the heat transfer performance. The whole test section is simulated in three-dimensional. Different channel materials have been investigated to find the best channel substrate material.

Aluminum Sand Casting Interfacial Heat Flux Estimation Based on Corrected Temperature Measurements

2008 ◽  
Author(s):  
Jonathan W. Woolley ◽  
Keith A. Woodbury
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Heat Conduction ◽  
Kernel Method ◽  
Heat Conduction Problem ◽  
Inverse Heat Conduction Problem ◽  
Temperature Measurements ◽  
Inverse Heat Conduction ◽  
Interfacial Heat Transfer ◽  
Interfacial Heat Flux

The estimation of the heat flux at the interface between a solidifying metal casting and mold is a frequently investigated topic. Accurate knowledge of the interfacial heat transfer can be used in solidification simulation to reduce the time and cost of the casting design process. A common and well-established approach to estimating the interfacial heat flux is the solution of the inverse heat conduction problem. Temperature measurements from thermocouples imbedded in the sand mold are used as inputs to the inverse solver. It is well-documented that imbedded thermocouples which are subjected to high temperature gradients will yield biased temperature measurements. By accounting for the sensor dynamics with an appropriate model, the measured temperatures can be corrected to mitigate the effect of the bias error in the estimation of the heat flux. In a previous work, experimentally measured temperatures were obtained from aluminum sand castings and the interfacial heat transfer was evaluated. In other works, the temperature measurement error was demonstrated and the kernel method for correcting measured temperatures was demonstrated with a numerical experiment. In this paper, the simulation of the response of a thermocouple with a three-dimensional computational model is used with the kernel method to correct the experimentally measured temperatures. The previous interfacial heat flux estimates are updated by solving the inverse heat conduction problem with the corrected temperatures as the inputs.

Influence of Glass Coating Thickness on Interfacial Heat Transfer Coefficient during Forming of Nickel Based Superalloys

2013 ◽  
Vol 750 ◽  
pp. 104-107
Author(s):  
Markus Busuttil ◽  
Yu Pei Lin ◽  
Jean Christophe Gebelin ◽  
Roger C. Reed
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Numerical Modeling ◽  
Heat Transfer Coefficient ◽  
Transfer Coefficient ◽  
Coating Thickness ◽  
Work Piece ◽  
Interfacial Heat Transfer Coefficient ◽  
Glass Coating ◽  
Interfacial Heat Transfer

The influence of glass coating thickness on the interfacial heat transfer coefficient has been examined using numerical modeling. Temperature and heat flux during working of a Inconel 718 work-piece and colder H13 dies have been simulated. The thickness of the glass coating is found to have a significant influence on the forming characteristic.

THE MECHANISM OF RAISING AND QUANTIFICATION OF SPECIFIC HEAT FLUX AT BOILING OF NANOFLUIDS IN FREE CONVECTION CONDITIONS

2017 ◽  
pp. 25-34
Author(s):  
V.N. Moraru
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Heat Capacity ◽  
Specific Heat ◽  
Chemical Properties ◽  
Heating Surface ◽  
Physical Models ◽  
Superheated Liquid ◽  
Two Phase ◽  
Boiling Process

The results of our work and a number of foreign studies indicate that the sharp increase in the heat transfer parameters (specific heat flux q and heat transfer coefficient _) at the boiling of nanofluids as compared to the base liquid (water) is due not only and not so much to the increase of the thermal conductivity of the nanofluids, but an intensification of the boiling process caused by a change in the state of the heating surface, its topological and chemical properties (porosity, roughness, wettability). The latter leads to a change in the internal characteristics of the boiling process and the average temperature of the superheated liquid layer. This circumstance makes it possible, on the basis of physical models of the liquids boiling and taking into account the parameters of the surface state (temperature, pressure) and properties of the coolant (the density and heat capacity of the liquid, the specific heat of vaporization and the heat capacity of the vapor), and also the internal characteristics of the boiling of liquids, to calculate the value of specific heat flux q. In this paper, the difference in the mechanisms of heat transfer during the boiling of single-phase (water) and two-phase nanofluids has been studied and a quantitative estimate of the q values for the boiling of the nanofluid is carried out based on the internal characteristics of the boiling process. The satisfactory agreement of the calculated values with the experimental data is a confirmation that the key factor in the growth of the heat transfer intensity at the boiling of nanofluids is indeed a change in the nature and microrelief of the heating surface. Bibl. 20, Fig. 9, Tab. 2.

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