Piezoelectric properties of PZT thick film on Si prepared by an interfacial polymerization method

Author(s):  
T. Tsurumi ◽  
S. Ozawa ◽  
S. Wada ◽  
M. Yamane
2000 ◽  
Vol 39 (Part 1, No. 9B) ◽  
pp. 5604-5608 ◽  
Author(s):  
Takaaki Tsurumi ◽  
Shuichi Ozawa ◽  
Goro Abe ◽  
Naoki Ohashi ◽  
Satoshi Wada ◽  
...  

2009 ◽  
Vol 628-629 ◽  
pp. 405-410 ◽  
Author(s):  
Da Zhi Wang ◽  
R.A. Dorey

In this paper, electrohydrodynamic atomization combined with a polymeric micromoulding technique was used to form PZT single element devices using a PZT sol-gel slurry without an etching process. The PZT single element device was initially designed to work as a piezoelectric ultrasonic transducer consisting of a circular or a square of various sizes, which was produced and used to evaluate the process. The resulting PZT device had a homogenous microstructure. It was observed that the relative permittivity of the circular and square single element devices was especially high at small size due to the fringe effect. The results show that the radius and width of the PZT single circular and square element devices with a thickness of 15µm should be bigger than 400µm in order to reduce the fringe effect.


2011 ◽  
Vol 21 (2) ◽  
pp. 159-163 ◽  
Author(s):  
Zhong-xia DUAN ◽  
Guo-qin YU ◽  
Jun-biao LIU ◽  
Jun LIU ◽  
Xiao-wen DONG ◽  
...  
Keyword(s):  

Materials ◽  
2018 ◽  
Vol 11 (9) ◽  
pp. 1621 ◽  
Author(s):  
Tao Zhang ◽  
Jun Ou-Yang ◽  
Xiaofei Yang ◽  
Benpeng Zhu

Approximately 25 μm Pb(Mg1/3Nb2/3)O3–PbTiO3 (PMN-PT) thick film was synthesized based on a sol-gel/composite route. The obtained PMN-PT thick film was successfully transferred from the Silicon substrate to the conductive silver epoxy using a novel wet chemical method. The mechanism of this damage free transfer was explored and analyzed. Compared with the film on Silicon substrate, the transferred one exhibited superior dielectric, ferroelectric and piezoelectric properties. These promising results indicate that transferred PMN-PT thick film possesses the capability for piezoelectric device application, especially for ultrasound transducer fabrication. Most importantly, this chemical route opens a new path for transfer of thick film.


2015 ◽  
Vol 114 (4) ◽  
pp. 237-242 ◽  
Author(s):  
D. Ernst ◽  
B. Bramlage ◽  
S. E. Gebhardt ◽  
A. J. Schönecker

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