The SnAgCu solder joint integrity in WLCSP for green conversion

Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005. ◽

10.1109/isapm.2005.1432059 ◽

2005 ◽

Author(s):

J.C.B. Lee ◽

Chi-sheng Chung ◽

Chin-Chiang Liu ◽

Ho-Ming Tong

Keyword(s):

Solder Joint ◽

Snagcu Solder ◽

Joint Integrity

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Experimental evaluation of SnAgCu solder joint reliability in 100-μm pitch flip-chip assemblies

Microelectronics Reliability ◽

10.1016/j.microrel.2014.01.011 ◽

2014 ◽

Vol 54 (5) ◽

pp. 939-944 ◽

Author(s):

Ye Tian ◽

Xi Liu ◽

Justin Chow ◽

Yi Ping Wu ◽

Suresh K. Sitaraman

Keyword(s):

Solder Joint ◽

Experimental Evaluation ◽

Flip Chip ◽

Solder Joint Reliability ◽

Snagcu Solder ◽

Joint Reliability

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Board-level reliability of lead-free SnAgCu solder joint

Proceedings of the 4th International Symposium on Electronic Materials and Packaging, 2002. ◽

10.1109/emap.2002.1188851 ◽

2003 ◽

Author(s):

Jian-Shu Wu ◽

Shan-Pu Yu ◽

I-Hsuan Peng ◽

Jong-Lih Wang ◽

B. Chung

Keyword(s):

Solder Joint ◽

Lead Free ◽

Snagcu Solder ◽

Board Level ◽

Board Level Reliability

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Micromechanical modelling of SnAgCu solder joint under cyclic loading: Effect of grain orientation

Computational Materials Science ◽

10.1016/j.commatsci.2006.02.020 ◽

2007 ◽

Vol 39 (1) ◽

pp. 187-197 ◽

Author(s):

Jicheng Gong ◽

Changqing Liu ◽

Paul P. Conway ◽

Vadim V. Silberschmidt

Keyword(s):

Cyclic Loading ◽

Solder Joint ◽

Grain Orientation ◽

Micromechanical Modelling ◽

Loading Effect ◽

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FEM analysis of SnAgCu solder joint in flip chip

2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits ◽

10.1109/ipfa.2009.5232617 ◽

2009 ◽

Author(s):

Yongchang ◽

Yan Xiaoyan Li ◽

Na Liu

Keyword(s):

Solder Joint ◽

Flip Chip ◽

Fem Analysis ◽

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Certainty of measurement using an automated infra-red laser inspection instrument for PCB solder joint integrity

Journal of Physics E Scientific Instruments ◽

10.1088/0022-3735/18/8/008 ◽

1985 ◽

Vol 18 (8) ◽

pp. 676-683 ◽

Author(s):

M P Seah ◽

C Lea

Keyword(s):

Solder Joint ◽

Infra Red ◽

Joint Integrity

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Endoscopic inspection of solder joint integrity in chip scale packages

2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070) ◽

10.1109/ectc.2000.853215 ◽

2002 ◽

Author(s):

Y.C. Chan ◽

C.W. Tang ◽

P.L. Tu

Keyword(s):

Solder Joint ◽

Joint Integrity

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BGA brittle fracture - alternative solder joint integrity test methods

Proceedings Electronic Components and Technology, 2005. ECTC '05. ◽

10.1109/ectc.2005.1441422 ◽

2005 ◽

Author(s):

K. Newman

Keyword(s):

Brittle Fracture ◽

Solder Joint ◽

Test Methods ◽

Integrity Test ◽

Joint Integrity

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Study on the SnAgCu solder joint between LED chip and heat sink

2018 19th International Conference on Electronic Packaging Technology (ICEPT) ◽

10.1109/icept.2018.8480764 ◽

2018 ◽

Author(s):

W. Liu ◽

X.X. Qian ◽

J.T Lin

Keyword(s):

Solder Joint ◽

Heat Sink ◽

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An analysis of local deformation of SnAgCu solder joint using digital image correlation

2010 11th International Conference on Electronic Packaging Technology & High Density Packaging ◽

10.1109/icept.2010.5582845 ◽

2010 ◽

Author(s):

Nobuyuki Shishido ◽

Toshifumi Kanno ◽

Shinya Kawahara ◽

Toru Ikeda ◽

Noriyuki Miyazaki ◽

...

Keyword(s):

Digital Image Correlation ◽

Solder Joint ◽

Digital Image ◽

Local Deformation ◽

Image Correlation ◽

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Solder Joint Integrity of Various Surface Finished Build-Up Flip Chip Packages by 4-point Monotonic Bending Test

2005 7th Electronic Packaging Technology Conference ◽

10.1109/eptc.2005.1614449 ◽

2006 ◽

Author(s):

T. Nakamura ◽

Y. Miyamoto ◽

Y. Hosoi ◽

K. Newman

Keyword(s):

Solder Joint ◽

Flip Chip ◽

Bending Test ◽

Joint Integrity

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