Development of a Silicon Photonics-based Light Source for Compact Resonator Fiber Optic Gyroscopes

Author(s):  
M. Smiciklas ◽  
G. Sanders ◽  
L. Strandjord ◽  
W. Williams ◽  
E. Benser ◽  
...  
Nanophotonics ◽  
2020 ◽  
Vol 0 (0) ◽  
Author(s):  
Wei Shi ◽  
Ye Tian ◽  
Antoine Gervais

AbstractThe tremendous growth of data traffic has spurred a rapid evolution of optical communications for a higher data transmission capacity. Next-generation fiber-optic communication systems will require dramatically increased complexity that cannot be obtained using discrete components. In this context, silicon photonics is quickly maturing. Capable of manipulating electrons and photons on the same platform, this disruptive technology promises to cram more complexity on a single chip, leading to orders-of-magnitude reduction of integrated photonic systems in size, energy, and cost. This paper provides a system perspective and reviews recent progress in silicon photonics probing all dimensions of light to scale the capacity of fiber-optic networks toward terabits-per-second per optical interface and petabits-per-second per transmission link. Firstly, we overview fundamentals and the evolving trends of silicon photonic fabrication process. Then, we focus on recent progress in silicon coherent optical transceivers. Further scaling the system capacity requires multiplexing techniques in all the dimensions of light: wavelength, polarization, and space, for which we have seen impressive demonstrations of on-chip functionalities such as polarization diversity circuits and wavelength- and space-division multiplexers. Despite these advances, large-scale silicon photonic integrated circuits incorporating a variety of active and passive functionalities still face considerable challenges, many of which will eventually be addressed as the technology continues evolving with the entire ecosystem at a fast pace.


2021 ◽  
Author(s):  
Xin Chen ◽  
Miao Yan ◽  
Jie Yu ◽  
Ruoxiang Tang

2019 ◽  
Vol 9 (2) ◽  
pp. 11-15
Author(s):  
Sisca Arisya Harry Andhina

Macrobending often occurs in optical fibers that embedded in the ground due to shifting of soil or rocks in the ground causing interference in transmission. In this study used single-mode-multimode-singlemode fiber optic cable connected manually and axially measured using a light source test equipment and optical power meter and the results will be compared. The measurement results obtained the greater  value of macrobending losses with the smaller the diameter of the winding, and the greater the number of turns. The highest value of macrobending losses in multimode cables is -1.48dB at 0.5cm diameter with 5 turns, highest value of macrobending losses on single mode cables is -12.73dB at 0.5cm diameter with 5 turns,  lowest value of macrobending losses for multimode cables is -0.44dB at 5cm diameter with 1 twist, lowest macrobending losses in singlemode cables is -1.69dB at 5cm diameter with 1 twist. While the value of macrobending losses on axially connected SMS cables shows the highest value of macrobending losses on multimode cables is -1.12dB in diameter of 0.5cm with 5 turns,  highest value of macrobending losses on singlemode cables is -1.18dB at diameter of 0.5cm with 5 turns,  lowest value for macrobending losses on multimode cables is -0.66dB at 5cm in diameter with 1 twist, the smallest value for macrobending losses on singlemode cables is -0.27dB at 5cm diameter with 1 twist . The measurement results also showed that the macrobending losses of manually connected SMS cables were greater than the macrobending losses of axially connected SMS cables.


2016 ◽  
Vol 2016 (DPC) ◽  
pp. 001663-001681
Author(s):  
Miguel Jimarez

We introduce a high-speed 4x25Gbps, MSA-compliant, QSFP transceiver built on a Silicon Photonics platform. The transceiver integrates high sensitivity receivers, CTLE, clock recovery, modulator drivers and BIST on a TSMC 28nm die connected to the photonic die thru a fine pitch (50um) Copper Pillar interface. A wafer-scale approach, Chip on Wafer, CoW, is used to assemble the electronic die and the light source on to the photonic die, so that the full optical path can be tested, at speed, in loopback configuration in wafer form, using a standard ATE solution. This presentation focuses on the CoW assembly development aspects of the transceiver. Wafer probe and bump, die processing services, CoW assembly and Back End of Line, BEOL, Test Services will be presented.


2010 ◽  
Vol 31 (1) ◽  
pp. 57-58 ◽  
Author(s):  
Alberto J. de Armendi ◽  
Mohanad Shukry ◽  
Pratistha Strong ◽  
Jorge A. Cure

2008 ◽  
Vol 47 (4) ◽  
pp. 3236-3239 ◽  
Author(s):  
Mu-Chun Wang ◽  
Zhen-Ying Hsieh ◽  
Yuan-Tai Tseng ◽  
Fan-Gang Tseng ◽  
Heng-Sheng Huang ◽  
...  

Sign in / Sign up

Export Citation Format

Share Document