Drop impact reliability analysis of CSP packages at board and product system levels through modeling approaches
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2005 ◽
Vol 28
(3)
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pp. 449-456
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2018 ◽
Vol 8
(10)
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pp. 1788-1799
2006 ◽
Vol 46
(7)
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pp. 1160-1171
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2002 ◽
Vol 2002
(0)
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pp. 239-240
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