Drop impact reliability analysis of CSP packages at board and product levels through modeling approaches

2005 ◽  
Vol 28 (3) ◽  
pp. 449-456 ◽  
Author(s):  
Liping Zhu ◽  
W. Marcinkiewicz
Keyword(s):  
Reliability Analysis ◽  
Drop Impact ◽  
Modeling Approaches ◽  
Impact Reliability

Drop impact reliability testing for lead-free and lead-based soldered IC packages

2006 ◽  
Vol 46 (7) ◽  
pp. 1160-1171 ◽  
Author(s):  
Desmond Y.R. Chong ◽  
F.X. Che ◽  
John H.L. Pang ◽  
Kellin Ng ◽  
Jane Y.N. Tan ◽  
...  
Keyword(s):  
Drop Impact ◽  
Lead Free ◽  
Reliability Testing ◽  
Impact Reliability

Examination of the impact test equipment used for the assessment of drop impact reliability for the solder joints

2002 ◽  
Vol 2002 (0) ◽  
pp. 239-240
Author(s):  
Qiang YU ◽  
Hironobu KIKUCHI ◽  
Keiji WATANABE ◽  
Manabu KAKINO ◽  
Noriyuki FUJIWARA ◽  
...  
Keyword(s):  
Impact Test ◽  
Solder Joints ◽  
Drop Impact ◽  
Test Equipment ◽  
Impact Reliability ◽  
The Impact
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