Two-phase liquid cooling system for electronics, part 4: Modeling and simulations

2017 ◽  
Author(s):  
JacksonB. Marcinichen ◽  
Raffaele L. Amalfi ◽  
Nicolas Lamaison ◽  
Todd Salamon ◽  
John R. Thome
Keyword(s):  
Cooling System ◽  
Modeling And Simulations ◽  
Liquid Cooling ◽  
Two Phase ◽  
Phase Liquid ◽  
Liquid Cooling System

Role of a Liquid Accumulator in a Passive Two-Phase Liquid Cooling System for Electronics: Experimental Analysis

2017 ◽  
Author(s):  
Nicolas Lamaison ◽  
Raffaele L. Amalfi ◽  
Jackson B. Marcinichen ◽  
John R. Thome ◽  
Todd Salamon
Keyword(s):  
Cooling System ◽  
Flow Boiling ◽  
Relative Size ◽  
Electronics Cooling ◽  
Filling Ratio ◽  
Liquid Cooling ◽  
Two Phase ◽  
Wide Range ◽  
Phase Liquid ◽  
Liquid Cooling System

Gravity-driven two-phase liquid cooling systems using flow boiling within micro-scale evaporators are becoming a game-changing solution for electronics cooling. The optimization of the system’s filling ratio can however become a challenging problem for a system operating over a wide range of cooling capacities and temperature ranges. The benefits of a liquid accumulator to overcome this difficulty are evaluated in the present paper. An experimental thermosyphon cooling system was built to cool multiple electronic components up to a power dissipation of 1800 W. A double-ended cylinder with a volume of 150 cm3 is evaluated as the liquid accumulator for two different system volumes (associated to two different condensers). Results demonstrated that the liquid accumulator provided robust thermal performance as a function of filling ratio for the entire range of heat loads tested. In addition, the present liquid accumulator was more effective for a small volume system, 599 cm3, than for a large volume system, 1169 cm3, in which the relative size of the liquid accumulator increased from 12.8 % to 25% of the total system’s volume.

Role of a Liquid Accumulator in a Passive Two-Phase Liquid Cooling System for Electronics: Experimental Analysis

2018 ◽  
Vol 140 (1) ◽  
Author(s):  
Nicolas Lamaison ◽  
Raffaele L. Amalfi ◽  
Todd Salamon ◽  
Jackson B. Marcinichen ◽  
John R. Thome
Keyword(s):  
Cooling System ◽  
Flow Boiling ◽  
Relative Size ◽  
Electronics Cooling ◽  
Liquid Cooling ◽  
Two Phase ◽  
Wide Range ◽  
Gravity Driven ◽  
Phase Liquid ◽  
Liquid Cooling System

Gravity-driven two-phase liquid cooling systems using flow boiling within microscale evaporators are becoming a game-changing solution for electronics cooling. The optimization of the system's filling ratio (FR) can however become a challenging problem for a system operating over a wide range of cooling capacities and temperature ranges. The benefits of a liquid accumulator (LA) to overcome this difficulty are evaluated in the present paper. An experimental thermosyphon cooling system was built to cool multiple electronic components up to a power dissipation of 1800 W. A double-ended cylinder with a volume of 150 cm3 is evaluated as the LA for two different system volumes (associated with two different condensers). Results demonstrated that the LA provided robust thermal performance as a function of FR for the entire range of heat loads tested. In addition, the present LA was more effective for a small volume system, 599 cm3, than for a large volume system, 1169 cm3, in which the relative size of the LA increased from 12.8% to 25% of the total system's volume.

scholarly journals The study of gas-liquid flow dynamics in the inclined-corrugated elements of cooling tower filler unit

2019 ◽  
Vol 126 ◽  
pp. 00031 ◽  
Author(s):  
lnur N. Madyshev ◽  
Aliya I. Khafizova ◽  
Oksana S. Dmitrieva
Keyword(s):  
Liquid Flow ◽  
Cooling Tower ◽  
Cooling System ◽  
Flow Dynamics ◽  
Stable Operation ◽  
Liquid Cooling ◽  
Two Phase ◽  
Liquid Drops ◽  
Gas Liquid Flow ◽  
Liquid Cooling System

This paper deals with the studies of cooling tower, operated with the contactless evaporative cooling technology. The authors developed the cooling tower with a three-flow liquid cooling system. The authors conducted the numerical studies of gas-liquid flow dynamics in the inclined-corrugated elements of checker filling unit that allows to give us an idea of two-phase flow structure, its movement throughout the checker filling, as well as to assess the influence of mode parameters on the efficiency of collecting the liquid drops and the range of stable operation of device. The most effective operation of this device is at the pressure drop of 100 Pa, while developing the average air flow rate in the element up to 3.2 m/s.

Single-Phase Liquid Cooling of a Quad-Core Processor

2011 ◽  
Author(s):  
Anjali Chauhan ◽  
Bahgat Sammakia ◽  
Furat F. Afram ◽  
Kanad Ghose ◽  
Gamal Refai-Ahmed ◽  
...  
Keyword(s):  
Single Phase ◽  
Heat Dissipation ◽  
Cooling System ◽  
Hot Spot ◽  
Floor Plan ◽  
Liquid Cooling ◽  
Uniform Heat ◽  
Phase Liquid ◽  
Liquid Cooling System ◽  
Planar Flows

Multicore microprocessor chips have emerged as an industry standard in recent years and have enabled Moore’s Law to be sustained when one considers the collective performance achieved by multiple cores. The industry has favored floor plans that use identical or symmetric layouts of individual cores in a linear array or a two-dimensional (2D) array, oblivious to the non-uniform heat dissipation within each core. Such non-uniform heat dissipations have hot spots within each core that must be aggressively cooled to avoid temporary or permanent device failures that can result from high temperature gradients. This paper evaluates alternative core layouts and microchannel configurations of a single-phase liquid cooling system for multi-core chips. We first examine the use of different planar flow patterns in microchannels for a realistic quad-core processor with non-uniform energy dissipation within each core. The direction of the flows in the microchannels is varied to achieve minimum hot spot temperatures on the die. A symmetric layout of the four cores with minimum achievable hot spot temperature is then selected and subjected to impingement flow. We establish the thermal efficiency of the optimized core floor plan compared to the traditional floor plan in a quad-core design and show that impingement provides the most efficient cooling solution compared to microchannels with planar flows for the same pressure difference.

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