Effect of Deposition Gas Ratio, RF Power, and Substrate Temperature on the Charging/Discharging Processes in PECVD Silicon Nitride Films for Electrostatic NEMS/MEMS Reliability Using Atomic Force Microscopy
2011 ◽
Vol 20
(6)
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pp. 1395-1418
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Keyword(s):
Rf Power
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2000 ◽
Vol 154-155
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pp. 337-344
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Keyword(s):
Keyword(s):
Keyword(s):
1997 ◽
Vol 6
(4)
◽
pp. 303-306
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Keyword(s):