JMEMS Letters Ultra-Low Stress Die Attachment Based on a Stacked Multilayer Substrate

2021 ◽  
pp. 1-3
Author(s):  
Zhongye Wu ◽  
Shangshu Yang ◽  
Longjian Xue ◽  
Chengliang Sun ◽  
Sheng Liu ◽  
...  
Keyword(s):  
Die Attachment ◽  
Multilayer Substrate

Research of LTCC/Cu, Ag multilayer substrate in microelectronic packaging

2002 ◽  
Vol 94 (1) ◽  
pp. 48-53 ◽  
Author(s):  
Yonggang Wang ◽  
Guangneng Zhang ◽  
Jusheng Ma
Keyword(s):  
Microelectronic Packaging ◽  
Multilayer Substrate

A novel Cu@Sn@Ag core-shell particles for die attachment in power device packaging

2021 ◽  
Author(s):  
Jiahao Liu ◽  
Hui Xiao ◽  
Xiaotong Guo ◽  
Xinjie Wang ◽  
Zhijun Yao ◽  
...  
Keyword(s):  
Power Device ◽  
Core Shell ◽  
Die Attachment ◽  
Shell Particles
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