Leakage Resilient Laser Sensor for Self Calibrated Interferometry using Orthogonal Nano-Fabrication

2021 ◽  
Author(s):  
N. Z. Azeemi
Keyword(s):  
Laser Sensor ◽  
Nano Fabrication ◽  
Leakage Resilient

UHV-STM studies of silicon nano-pyramid growth on silicon surface at high temperature

1992 ◽  
Vol 50 (2) ◽  
pp. 1144-1145
Author(s):  
T. Sato ◽  
S. Kitamura ◽  
T. Sueyoshl ◽  
M. Iwatukl ◽  
C. Nielsen
Keyword(s):  
High Temperature ◽  
Relaxation Process ◽  
Thermal Effect ◽  
Bias Voltage ◽  
Silicon Surface ◽  
Growth Process ◽  
Tunneling Current ◽  
Fabrication Technique ◽  
Nano Fabrication ◽  
Electromigration Effect

Recently, the growth process and relaxation process of crystalline structures were studied by observing a SI nano-pyramid which was built on a Si surface with a UHV-STM. A UHV-STM (JEOL JSTM-4000×V) was used for studying a heated specimen, and the specimen was kept at high temperature during observation. In this study, the nano-fabrication technique utilizing the electromigration effect between the STM tip and the specimen was applied. We observed Si atoms migrated towords the tip on a high temperature Si surface.Clean surfaces of Si(lll)7×7 and Si(001)2×l were prepared In the UHV-STM at a temperature of approximately 600 °C. A Si nano-pyramid was built on the Si surface at a tunneling current of l0nA and a specimen bias voltage of approximately 0V in both polarities. During the formation of the pyramid, Images could not be observed because the tip was stopped on the sample. After the formation was completed, the pyramid Image was observed with the same tip. After Imaging was started again, the relaxation process of the pyramid started due to thermal effect.

Virtual Vault: A Practical Leakage Resilient Scheme Using Space-Hard Ciphers

2021 ◽  
Vol E104.A (1) ◽  
pp. 182-189
Author(s):  
Yuji KOIKE ◽  
Takuya HAYASHI ◽  
Jun KURIHARA ◽  
Takanori ISOBE
Keyword(s):  
Leakage Resilient

Laser Sensor Database: Tape Distributions

1991 ◽  
Author(s):  
D. C. Carmer ◽  
J. L. Grooms
Keyword(s):  
Laser Sensor

scholarly journals Ripple Formation during Oblique Angle Etching

Coatings ◽  
2019 ◽  
Vol 9 (4) ◽  
pp. 272
Author(s):  
Mehmet F. Cansizoglu ◽  
Mesut Yurukcu ◽  
Tansel Karabacak
Keyword(s):  
Plasma Etching ◽  
Incidence Angle ◽  
Incident Beam ◽  
Root Mean Square Roughness ◽  
Sticking Coefficient ◽  
Oblique Angle ◽  
Nano Fabrication ◽  
Ripple Formation ◽  
Rapid Formation ◽  
Roughness Analysis

Chemical removal of materials from the surface is a fundamental step in micro- and nano-fabrication processes. In conventional plasma etching, etchant molecules are non-directional and perform a uniform etching over the surface. However, using a highly directional obliquely incident beam of etching agent, it can be possible to engineer surfaces in the micro- or nano- scales. Surfaces can be patterned with periodic morphologies like ripples and mounds by controlling parameters including the incidence angle with the surface and sticking coefficient of etching particles. In this study, the dynamic evolution of a rippled morphology has been investigated during oblique angle etching (OAE) using Monte Carlo simulations. Fourier space and roughness analysis were performed on the resulting simulated surfaces. The ripple formation was observed to originate from re-emission and shadowing effects during OAE. Our results show that the ripple wavelength and root-mean-square roughness evolved at a more stable rate with accompanying quasi-periodic ripple formation at higher etching angles (θ > 60°) and at sticking coefficient values (Sc) 0.5 ≤ Sc ≤ 1. On the other hand, smaller etching angle (θ < 60°) and lower sticking coefficient values lead to a rapid formation of wider and deeper ripples. This result of this study can be helpful to develop new surface patterning techniques by etching.

Continuous leakage-resilient certificate-based signcryption scheme and application in cloud computing

2021 ◽  
Vol 860 ◽  
pp. 1-22
Author(s):  
Yanwei Zhou ◽  
Yuan Xu ◽  
Zirui Qiao ◽  
Bo Yang ◽  
Mingwu Zhang
Keyword(s):  
Cloud Computing ◽  
Leakage Resilient ◽  
Signcryption Scheme

Investigations on the positioning accuracy of the Nano Fabrication Machine (NFM-100)

2021 ◽  
Vol 0 (0) ◽  
Author(s):  
Jaqueline Stauffenberg ◽  
Ingo Ortlepp ◽  
Ulrike Blumröder ◽  
Denis Dontsov ◽  
Christoph Schäffel ◽  
...  
Keyword(s):  
Target Position ◽  
Repeated Measurements ◽  
Scanning Probe ◽  
Measuring System ◽  
Direct Drive ◽  
Positioning Accuracy ◽  
Scanning Probe Lithography ◽  
Nano Fabrication ◽  
Atomic Force ◽  
Acceleration And Deceleration

Abstract This contribution deals with the analysis of the positioning accuracy of a new Nano Fabrication Machine. This machine uses a planar direct drive system and has a positioning range up to 100 mm in diameter. The positioning accuracy was investigated in different movement scenarios, including phases of acceleration and deceleration. Also, the target position error of certain movements at different positions of the machine slider is considered. Currently, the NFM-100 is equipped with a tip-based measuring system. This Atomic Force Microscope (AFM) uses self-actuating and self-sensing microcantilevers, which can be used also for Field-Emission-Scanning-Probe-Lithography (FESPL). This process is capable of fabricating structures in the range of nanometres. In combination with the NFM-100 and its positioning range, nanostructures can be analysed and written in a macroscopic range without any tool change. However, the focus in this article is on the measurement and positioning accuracy of the tip-based measuring system in combination with the NFM-100 and is verified by repeated measurements. Finally, a linescan, realised using both systems, is shown over a long range of motion of 30 mm.

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