The stress determination method on the environmental stress screening test based on the physical of failure

Author(s):  
Manman Mu ◽  
Xiaohong Wang ◽  
Wenhui Fan ◽  
Yuxiang Lee
Author(s):  
Ming-Yi You

An integrated optimization framework for multi-cycle environmental stress screening tests and preventive maintenance scheduling is proposed. The proposed framework considers the improvement of product reliability through environmental stress screening tests and the associated screening cost, and the effect of preventive maintenance schedule on the maintenance cost as well. The environmental stress screening model is extended first to be applicable for multi-cycle environmental stress screening tests. The extended environmental stress screening model characterizes the product reliability function which survives the environmental stress screening test in terms of both the number of environmental stress screening cycles and the severity of screening stress. Afterwards, an integrated cost model is established by considering the cost of preventive maintenance, the cost of corrective maintenance, the cost of environmental stress screening test, and the cost due to failure of products in the environmental stress screening test. The application case study demonstrates the implementation procedures and the application effectiveness of the proposed approach. The application results show that, considering the cost due to environmental stress screening and the cost due to maintenance separately could lead to suboptimal decisions. For enterprises responsible for both environmental stress screening and maintenance, it is suggested to optimize the environmental stress screening test and maintenance scheduling jointly to minimize the overall cost.


2004 ◽  
Vol 854 ◽  
Author(s):  
Christophe Malhaire ◽  
Alexandru Andrei ◽  
Sebastiano Brida ◽  
Daniel Barbier

ABSTRACTThe purpose of the present work was to study the long term stress stability of thin films used in harsh environment sensors. A stress determination method, based on cantilevers curvatures measurements, checked by means of 3D finite element simulations, has been proposed. Stress measurements for dielectric (silicon oxide and nitride) and metallic (AlTi and TiW) thin films have been periodically performed at room temperature, after standard annealing (450°C / 30 min in a N2+H2 atmosphere) and after 4 weeks thermal aging at 150°C or 200°C.


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