Effects of back contact resistance, depletion width and relaxation time distributions in admittance spectroscopy of CZTSe devices

Author(s):  
A. E. Caruso ◽  
D. S. Pruzan ◽  
E. A. Lund ◽  
M. A. Scarpulla
2014 ◽  
Vol 120 ◽  
pp. 412-416 ◽  
Author(s):  
Seung-Yoon Lee ◽  
Hongsik Choi ◽  
Hongmei Li ◽  
Kwangsun Ji ◽  
Seunghoon Nam ◽  
...  

2011 ◽  
Vol 679-680 ◽  
pp. 816-819 ◽  
Author(s):  
Amador Pérez-Tomás ◽  
A. Fontserè ◽  
Marcel Placidi ◽  
N. Baron ◽  
Sébastien Chenot ◽  
...  

The temperature dependence of Ohmic contacts to GaN devices is investigated in this paper via by measuring TLM contact resistances TLM vs Tas a function of temperature. measurements. In particular, the two types of Ohmic contacts are considered: (1) Contacts to highly doped implanted regions (such as the MOSFET drain/source contacts or the back contact of Schottky diodes) and (2) contacts to the 2 dimensional electron gas (2DEG) of an AlGaN/GaN heterojunction.


2019 ◽  
Vol 203 ◽  
pp. 110201 ◽  
Author(s):  
Siddhartha Garud ◽  
Cham Thi Trinh ◽  
Holger Rhein ◽  
Sven Kühnapfel ◽  
Stefan Gall ◽  
...  

2020 ◽  
Vol 128 (14) ◽  
pp. 143102
Author(s):  
Michael A. Lloyd ◽  
Austin G. Kuba ◽  
Brian E. McCandless ◽  
Robert Birkmire

2010 ◽  
Vol 53 (9) ◽  
pp. 2337-2341 ◽  
Author(s):  
XuLin He ◽  
JingQuan Zhang ◽  
LiangHuan Feng ◽  
LiLi Wu ◽  
Wei Li ◽  
...  

Author(s):  
A.K. Rai ◽  
A.K. Petford-Long ◽  
A. Ezis ◽  
D.W. Langer

Considerable amount of work has been done in studying the relationship between the contact resistance and the microstructure of the Au-Ge-Ni based ohmic contacts to n-GaAs. It has been found that the lower contact resistivity is due to the presence of Ge rich and Au free regions (good contact area) in contact with GaAs. Thus in order to obtain an ohmic contact with lower contact resistance one should obtain a uniformly alloyed region of good contact areas almost everywhere. This can possibly be accomplished by utilizing various alloying schemes. In this work microstructural characterization, employing TEM techniques, of the sequentially deposited Au-Ge-Ni based ohmic contact to the MODFET device is presented.The substrate used in the present work consists of 1 μm thick buffer layer of GaAs grown on a semi-insulating GaAs substrate followed by a 25 Å spacer layer of undoped AlGaAs.


1978 ◽  
Vol 39 (C6) ◽  
pp. C6-1215-C6-1216
Author(s):  
H. Ahola ◽  
G.J. Ehnholm ◽  
S.T. Islander ◽  
B. Rantala

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