A Modified Interleaved Active-Clamp Flyback Converter for Improving Power Efficiency and Power Density

Author(s):  
Dazhuang Ma ◽  
Jiahui Jiang
Energies ◽  
2020 ◽  
Vol 13 (16) ◽  
pp. 4160
Author(s):  
Xiaobin Li ◽  
Hongbo Ma ◽  
Junhong Yi ◽  
Song Lu ◽  
Jianping Xu

Compared with conventional forward converters, active clamp forward (ACF) converters have many advantages, including lower voltage stress on the primary power devices, the ability to switch at zero voltage, reduced EMI and duty cycle operation above 50%. Thus, it has been the most popular solution for the low bus voltage applications, such as 48 V and 28 V. However, because of the poor performance of Si MOSFETs, the efficiency of active clamp forward converters is difficult to further improved. Focusing on the bus voltage of 28 V with 18~36 V voltage range application, the Gallium Nitride high electron-mobility transistors (GaN HEMT) with ultralow on-resistance, low parasitic capacitances, and no reverse recovery, is incorporated into active clamp forward converters for achieving higher efficiency and power density, in this paper. Meanwhile, the comparative analysis is performed for Si MOSFET and GaN HEMT. In order to demonstrate the feasibility and validity of the proposed solution and comparative analysis, two 18~36 V input, 120 W/12 V output, synchronous rectification prototype with different power devices are built and compared in the lab. The experimental results show the GaN version can achieve the efficiency of 95.45%, which is around 1% higher than its counterpart under the whole load condition and the same power density of 2.2 W/cm3.


Author(s):  
Jing-Sheng Wong ◽  
Hung-Chia Wang ◽  
Chih-Wei Lin ◽  
Hao-Yu Xu ◽  
Yan-Ying Su ◽  
...  

2003 ◽  
Vol 793 ◽  
Author(s):  
Rama Venkatasubramanian ◽  
Brooks O'Quinn ◽  
Edward Siivola ◽  
Kip Coonley ◽  
Pratima Addepally ◽  
...  

ABSTRACTThin-film nano-structured materials offer the potential to enhance the performance of thermoelectrics, with near-term capabilities like small-footprint coolers for lasers and microprocessors. Our recent focus has been to transition the enhanced figure-of-merit (ZT) in p-type Bi2Te3/Sb2Te3 and n-type Bi2Te3/Bi2Te3-xSex superlattices to performance at the module level with several device demonstrations. We have been able to obtain a best ZT of ∼2 in a p-n couple, the fundamental cooling or power conversion unit in an operational module. In addition, we have been able to demonstrate p-n couple ZT of as much as 1.6 from heat-to-power efficiency data. The thermal interface resistances between the active device and the external heat source have been optimized. A power level of 38 mW per couple for a ΔT of about 107K, with 4-micron-thick element, was obtained. This translates to an active power density of ∼54 W/cm2 and a mini-module power density of ∼10.5 W/cm2. In short, power devices with thin-film superlattices are a real possibility. In the cooling arena, we have been able to obtain over 50K active cooling with thin-film modules, useable in several laser and microprocessor cooling needs. This is in spite of severe thermal management issues that had to be overcome noting that the “true” hot-side temperature, and hence the “true” ΔT, across the device are much higher. Even so, we have p-n superlattice couples that show twice the cooling ΔTmax, compared to the best bulk p-n couples at cryogenic temperatures. Some of the challenges that remain to be addressed in the full development of this materials technology and thoughts on further progress in nano-structured materials are presented.


Author(s):  
Remi Perrin ◽  
Nicolas Quentin ◽  
Bruno Allard ◽  
Christian Martin ◽  
Marwan Ali

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