A differential vertical hybrid coupler and low capacitance RF pads for millimeter-wave applications in 28 nm CMOS FDSOI

Author(s):  
Florian Voineau ◽  
Baudouin Martineau ◽  
Mathilde Sie ◽  
Anthony Ghiotto ◽  
Eric Kerherve
2018 ◽  
Vol 411 ◽  
pp. 21-26 ◽  
Author(s):  
Zhiwei Zheng ◽  
Miao Peng ◽  
Hui Zhou ◽  
Ming Chen ◽  
Leyong Jiang ◽  
...  

2019 ◽  
Vol 2 (9) ◽  
pp. 111-114 ◽  
Author(s):  
Cheng-Hsueh Tsai ◽  
Federico Pepe ◽  
Giovanni Mangraviti ◽  
Zhiwei Zong ◽  
Jan Craninckx ◽  
...  

2020 ◽  
Vol 55 (7) ◽  
pp. 1854-1863
Author(s):  
Cheng-Hsueh Tsai ◽  
Zhiwei Zong ◽  
Federico Pepe ◽  
Giovanni Mangraviti ◽  
Jan Craninckx ◽  
...  

2015 ◽  
Vol 63 (6) ◽  
pp. 1910-1922 ◽  
Author(s):  
David Fritsche ◽  
Gregor Tretter ◽  
Corrado Carta ◽  
Frank Ellinger

2019 ◽  
Vol 12 (4) ◽  
pp. 293-302
Author(s):  
Jaber Moghaddasi ◽  
Ke Wu

AbstractThis paper presents a simple topology of 180° hybrid coupler with non-interspersed inputs and outputs, as opposed to the conventional rat-race topology. Such hybrid coupler topologies with inputs located on one side and outputs at the opposite side simplify the design of signal routings and module packaging when integrated with other circuits and components. It also relaxes the necessity of using auxiliary compensating components such as tapers, jumpers, and crossovers. The proposed coupler topology is theoretically analyzed through a T-matrix approach. The analysis comes up with design equations and diagrams that help choose the structural parameters for the desired specification. The simplicity and also the immunity against intrinsic parasitic effects within the proposed topology make it an excellent candidate for operation over any RF and millimeter-wave frequency bands, for applications such as automotive radar or E-band backhaul radio. To this end, a coupler based on the proposed scheme is realized for operation over 77 GHz and assessed through on-wafer measurements. Good agreement of the measured results with the simulated and analytical counterparts demonstrates the superior performance of the proposed 180° hybrid coupler.


1992 ◽  
Vol 260 ◽  
Author(s):  
William H. Haydl ◽  
R. J. Bojko ◽  
L. F. Eastman

ABSTRACTIn the development of air bridges for low capacitance crossovers, resists of 3–6μm thickness a e needed, which calls for special alignment techniques. A technique has been developed for an air bridge tec nology, which is realized entirely by electron beam lithography. Such an all-electron-beam technique for sub-micron devices and ultrahigh frequency circuits, results in a fast turn-around-time in the development of integrated circuits.Gold plated air bridges with 20 to 120 pm span, 5–60 μm width, 2.6 pm height, and 2–4 μm thickness, were realized on GaAs and InP.


2015 ◽  
Vol 36 (2) ◽  
pp. 87-89 ◽  
Author(s):  
Thomas Quemerais ◽  
Daniel Gloria ◽  
Dominique Golanski ◽  
Simon Bouvot
Keyword(s):  
High Q ◽  

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