scholarly journals Enhanced Quench Protection in REBa2Cu 3Oδ-7-Based Coils by Enhancing Three-Dimensional Quench Propagation via Thermally Conducting Electrical Insulation

2015 ◽  
Vol 25 (5) ◽  
pp. 1-11 ◽  
Author(s):  
Makita R. Phillips ◽  
Wan Kan Chan ◽  
Justin Schwartz
Keyword(s):  
Three Dimensional ◽  
Electrical Insulation ◽  
Thermally Conducting ◽  
Quench Propagation

Transferred-Substrate InGaAsP-Based Thermionic Emission Coolers

2000 ◽  
Author(s):  
Christopher J. LaBounty ◽  
Gerry Robinson ◽  
Patrick Abraham ◽  
Ali Shakouri ◽  
John E. Bowers
Keyword(s):  
Thermal Resistance ◽  
Three Dimensional ◽  
Thermionic Emission ◽  
Copper Film ◽  
Cooling Power ◽  
Material System ◽  
Inp Substrate ◽  
Order Of Magnitude ◽  
Thin Copper Film ◽  
Thermally Conducting

Abstract Most optoelectronic devices are based on III-V semiconductors such as the InP/InGaAsP material system. Solid state refrigerators based on the same material system can be monolithically integrated with optoelectronics. Thermionic emission cooling in InGaAsP-based heterostructures has been shown experimentally to provide cooling power densities of several 100 W/cm2. Cooling by several degrees across thin films on the order of a micron thick has been demonstrated. Thermionic emission of hot electrons over heterobarriers allows for enhanced cooling power beyond what is possible from the bulk thermoelectric properties. The thermal resistance of the InP substrate between the hot side of the thin film cooler and the heat sink is found to be a limitation in cooler performance. Several possibilities are examined for replacing the InP substrate with a higher thermally conducting one such as silicon, copper, or even diamond, and a process for substrate transfer to a thin copper film has been developed. Three-dimensional simulations predict an order of magnitude improvement in the thermal resistance of the substrate. Experimental results of packaged InGaAsP coolers with copper substrates will be discussed.

scholarly journals Numerical Simulation of Mixed Convective Flow Over a Three-Dimensional Horizontal Backward Facing Step

2005 ◽  
Vol 127 (9) ◽  
pp. 1027-1036 ◽  
Author(s):  
J. G. Barbosa Saldana ◽  
N. K. Anand ◽  
V. Sarin
Keyword(s):  
Convective Flow ◽  
Three Dimensional ◽  
Step Length ◽  
Expansion Ratio ◽  
Step Height ◽  
Streamwise Direction ◽  
Backward Facing Step ◽  
Thermal Features ◽  
Mixed Convective Flow ◽  
Thermally Conducting

Laminar mixed convective flow over a three-dimensional horizontal backward-facing step heated from below at a constant temperature was numerically simulated using a finite volume technique and the most relevant hydrodynamic and thermal features for air flowing through the channel are presented in this work. The channel considered in this work has an aspect ratio AR=4, and an expansion ratio ER=2, while the total length in the streamwise direction is 52 times the step height (L=52s) and the step length is equal to 2 times the step height (l=2s). The flow at the duct entrance was considered to be hydrodynamically fully developed and isothermal. The bottom wall of the channel was subjected to a constant high temperature while the other walls were treated to be adiabatic. The step was considered to be a thermally conducting block.

Three-dimensional quench propagation in HTS coils

2006 ◽  
Vol 42 (4) ◽  
pp. 975-978 ◽  
Author(s):  
V. Cavaliere ◽  
M. Cioffi ◽  
A. Formisano ◽  
R. Martone ◽  
G. Masullo
Keyword(s):  
Three Dimensional ◽  
Quench Propagation

Propagation of three-dimensional Alfvén waves in a stratified, thermally conducting solar wind

1996 ◽  
Vol 101 (A11) ◽  
pp. 24443-24456 ◽  
Author(s):  
S. Orlando ◽  
Y.-Q. Lou ◽  
R. Rosner ◽  
G. Peres
Keyword(s):  
Solar Wind ◽  
Three Dimensional ◽  
Alfven Waves ◽  
Alfvén Waves ◽  
Thermally Conducting

Suppression of Cellular Convection by Lateral Walls

1969 ◽  
Vol 91 (1) ◽  
pp. 145-150 ◽  
Author(s):  
D. K. Edwards
Keyword(s):  
Rayleigh Number ◽  
Cell Size ◽  
Critical Rayleigh Number ◽  
Three Dimensional ◽  
Arbitrary Degree ◽  
Spacing Ratio ◽  
Vertical Walls ◽  
The Stability ◽  
Thermally Conducting ◽  
Lateral Walls

An analysis is presented showing the effect on the critical Rayleigh number of inserting parallel vertical walls into a fluid heated from below. The walls are rigid (nonslippery) and thermally conducting to an arbitrary degree. Three-dimensional cellular convection between the walls is analyzed to determine the most unstable cell size, and the Rayleigh number for this cell size is calculated. It is shown that critical Rayleigh number based on either height or spacing can be made as large as may be desired by decreasing the spacing between vertical walls. At large height-to-spacing ratio with finite conducting walls a new form of the Rayleigh number is found to govern the stability. Experimental measurements are reported and compared to the analytical results.

The fundamental matrix in three-dimensional dissipative gasdynamics

1969 ◽  
Vol 39 (2) ◽  
pp. 209-225 ◽  
Author(s):  
Eric P. Salathe
Keyword(s):  
Steady Flow ◽  
Fundamental Matrix ◽  
Subsonic Flow ◽  
Three Dimensional ◽  
Conducting Fluid ◽  
Far Field ◽  
Flow Past ◽  
Thermally Conducting ◽  
Uniform Stream ◽  
Asymptotic Forms

Three-dimensional steady flow past a body placed in a uniform stream of viscous, thermally conducting fluid is considered within the framework of the Oseen approximation. Asymptotic forms for the fundamental matrix are obtained for both supersonic and subsonic flow. It is shown how the solution to the flow past a body may be obtained from the fundamental matrix, and that the fundamental matrix itself provides the far field flow.

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