Thermal design and optimization of natural convection polymer pin fin heat sinks

2005 ◽  
Vol 28 (2) ◽  
pp. 238-246 ◽  
Author(s):  
R. Bahadur ◽  
A. Bar-Cohen
Author(s):  
Xiaoyuan Ying ◽  
Fangming Ye ◽  
Ruitao Liu ◽  
Hua Bao

A design method for the thermoelectric cooling system is improved in this work based on a graphical approach. It is used to select an appropriate thermoelectric cooler (TEC) and determine the value of optimum input current. Theoretical analysis has been conducted to investigate the cooling performance of the system using the design method. Numerical simulation and experimental tests for the entire cooling system validate the calculation result, which indicates the high reliability of the theoretical design method. The temperature dependence of the heat sink resistance and the contact resistance are the major reasons for the small discrepancy. Research is then conducted based on the design method to investigate how a thermoelectric cooling system under natural convection performs, where the optimization of heat sinks at hot side of TEC is done by using the generalized correlations in the previous studies. Comparison is made between the thermoelectric cooling system and the bare-heat-sink system under natural convection. Results show that the thermal resistance of the heat sink attached to TEC is critical to the cooling performance of the whole system. Besides, TEC under natural convection can perform better than the passive cooling if the heat load is not very high (qc″≤20,000 W/m2). The design process and results can provide a useful guidance for other thermal engineers.


Author(s):  
Raj Bahadur ◽  
Avram Bar-Cohen

There is growing interest in the use of polymer composites with enhanced thermal conductivity for high performance fin arrays and heat sinks. However, the thermal conductivity of these materials is relatively low compared to conventional fin metals, and strongly orthotropic. Therefore, the design and optimization of such polymer pin fins requires extension of the one dimensional classical fin analysis to include two-dimensional orthotropic heat conduction effects. An analytical equation for heat transfer from a cylindrical pin fin with orthotropic thermal conductivity is derived and validated using detailed finite-element results. The thermal performance of such fins was found to be dominated by the axial thermal conductivity, but to depart from the classical fin solution with increasing values of a radius- and radial conductivity-based Biot number. Using these relations, it is determined that fin orthotropy does not materially affect the behavior of typical air-cooled fins. Alternatively, for heat transfer coefficients achievable with water cooling and conductivity ratios below 0.1, the fin heat transfer rate can fall more than 25% below the “classical” heat transfer rates. Detailed orthotropic fin temperature distributions are used to explain this discrepancy. Simplified orthotropic pin fin heat transfer equations are derived and validated over a wide range of orthotropic conditions.


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