Thermal Characteristics and Thermomechanical Reliability of Board-Level Stacked-Die Packages Subjected to Coupled Power and Thermal Cycling Test
2008 ◽
Vol 31
(2)
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pp. 495-502
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2016 ◽
Vol 2016
(HiTEC)
◽
pp. 000128-000133
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2005 ◽
Vol 128
(3)
◽
pp. 281-284
◽
Keyword(s):
Keyword(s):
2008 ◽
Vol 48
(1)
◽
pp. 132-139
◽
Keyword(s):
Keyword(s):