Thermal Fatigue and Failure Analysis of SnAgCu Solder Alloys With Minor Pb Additions

2011 ◽  
Vol 1 (10) ◽  
pp. 1594-1600 ◽  
Author(s):  
Maurice N. Collins ◽  
Jeff Punch ◽  
Richard Coyle ◽  
Michael Reid ◽  
Richard Popowich ◽  
...  
Keyword(s):  
Failure Analysis ◽  
Thermal Fatigue ◽  
Solder Alloys ◽  
Snagcu Solder

scholarly journals A Mechanistic Thermal Fatigue Model for SnAgCu Solder Joints

2018 ◽  
Vol 47 (5) ◽  
pp. 2526-2544 ◽  
Author(s):  
Peter Borgesen ◽  
Luke Wentlent ◽  
Sa’d Hamasha ◽  
Saif Khasawneh ◽  
Sam Shirazi ◽  
...  
Keyword(s):  
Thermal Fatigue ◽  
Solder Joints ◽  
Snagcu Solder ◽  
Fatigue Model

Observations of Changes in Rate Dependent Flow of SnAgCu Solder Alloys Due to Aging

2009 ◽  
Author(s):  
Sri Chaitra Chavali ◽  
Kaushik Mysore ◽  
Ganesh Subbarayan ◽  
Indranath Dutta
Keyword(s):  
Diffusion Processes ◽  
Flow Behavior ◽  
Intermetallic Particle ◽  
Particle Growth ◽  
Secondary Creep ◽  
Aging Effects ◽  
Solder Alloys ◽  
Creep Tests ◽  
Snagcu Solder ◽  
And Behavior

Aging affects both microstructure and behavior [1, 2]. Microstructural changes are driven by dislocation motion and diffusion processes. Together they affect the flow behavior in solder alloys. We address four aspects of solder microstructure and behavior as affected by aging (a) EDS studies on Ag dispersion in Sn matrix (b) a procedure for modeling intermetallic particle growth (c) a model for estimating effective viscosity of solder alloy (d) both primary and secondary creep models to predict aging effects on behavior. Solder samples were aged for different aging times (15, 30, 60, 90 days aging) and at different aging temperatures (25 C, 75 C, 125 C) prior to running creep tests. Another set of solder samples were similarly aged to characterize the microstructure. The creep data for the experiments are from a series of sixty four experiments performed using a micromechanical tester that is specially fitted with a sensitive capacitance gauge (with a resolution of 0.1 microns) to accurately measure viscoplastic responses of solder to applied loads.

Diffusion Creep of Realistic SnAgCu Solder Joints at Times and Stresses of Relevance to Thermal Fatigue

2020 ◽  
Vol 10 (2) ◽  
pp. 288-295
Author(s):  
T. Alghoul ◽  
L. Wentlent ◽  
R. Sivasubramony ◽  
C. Greene ◽  
P. Thompson ◽  
...  
Keyword(s):  
Thermal Fatigue ◽  
Solder Joints ◽  
Diffusion Creep ◽  
Snagcu Solder
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