scholarly journals Thermal fatigue life evaluation of SnAgCu solder joints in a multi-chip power module

2017 ◽  
Vol 841 ◽  
pp. 012014 ◽  
Author(s):  
C Barbagallo ◽  
G L Malgioglio ◽  
G Petrone ◽  
G Cammarata
Keyword(s):  
Fatigue Life ◽  
Thermal Fatigue ◽  
Solder Joints ◽  
Power Module ◽  
Snagcu Solder ◽  
Thermal Fatigue Life ◽  
Life Evaluation ◽  
Fatigue Life Evaluation

PS08 Thermal Fatigue Life Evaluation of S45C/Cu/Si_3N_4 Composites Subjected to Cyclic Thermal Loadings

2012 ◽  
Vol 2012 (0) ◽  
pp. _PS08-1_-_PS08-3_
Author(s):  
Kosuke MIZUI ◽  
Nobuhiro SETTSU ◽  
Manabu TAKAHASHI ◽  
Masafumi MATSUSHITA
Keyword(s):  
Fatigue Life ◽  
Thermal Fatigue ◽  
Thermal Fatigue Life ◽  
Life Evaluation ◽  
Fatigue Life Evaluation

scholarly journals Thermal Fatigue Life Evaluation of Lead-Free Solder Joint of Chip Size Package with Underfill

2008 ◽  
Vol 72 (3) ◽  
pp. 244-248 ◽  
Author(s):  
Tomotake Tohei ◽  
Ikuo Shohji ◽  
Keisuke Yoshizawa ◽  
Masaharu Nishimoto ◽  
Takayuki Kawano ◽  
...  
Keyword(s):  
Fatigue Life ◽  
Solder Joint ◽  
Thermal Fatigue ◽  
Lead Free ◽  
Lead Free Solder ◽  
Thermal Fatigue Life ◽  
Life Evaluation ◽  
Chip Size ◽  
Fatigue Life Evaluation ◽  
Free Solder
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