Investigating the Fine Microstructure of Mn-doped SnAgCu Solder Alloys by Selective Electrochemical Etching

2018 ◽  
Author(s):  
Oliver Krammer ◽  
Tamas Hurtony
Keyword(s):  
Electrochemical Etching ◽  
Solder Alloys ◽  
Snagcu Solder ◽  
Fine Microstructure ◽  
Mn Doped

scholarly journals Effect of Cu Content on Performance of Sn-Zn-Cu Lead-Free Solder Alloys Designed by Cluster-Plus-Glue-Atom Model

Materials ◽  
2021 ◽  
Vol 14 (9) ◽  
pp. 2335
Author(s):  
Jialong Qiu ◽  
Yanzhi Peng ◽  
Peng Gao ◽  
Caiju Li
Keyword(s):  
Tensile Strength ◽  
Solder Alloy ◽  
Tensile Tests ◽  
Melting Behavior ◽  
Second Phase ◽  
Solder Alloys ◽  
Cu Content ◽  
Diffusion Force ◽  
Fine Microstructure ◽  
Effect Of Copper

The mechanical properties of solder alloys are a performance that cannot be ignored in the field of electronic packaging. In the present study, novel Sn-Zn solder alloys were designed by the cluster-plus-glue-atom (CPGA) model. The effect of copper (Cu) addition on the microstructure, tensile properties, wettability, interfacial characterization and melting behavior of the Sn-Zn-Cu solder alloys were investigated. The Sn29Zn4.6Cu0.4 solder alloy exhibited a fine microstructure, but the excessive substitution of the Cu atoms in the CPGA model resulted in extremely coarse intermetallic compound (IMC). The tensile tests revealed that with the increase in Cu content, the tensile strength of the solder alloy first increased and then slightly decreased, while its elongation increased slightly first and then decreased slightly. The tensile strength of the Sn29Zn4.6Cu0.4 solder alloy reached 95.3 MPa, which was 57% higher than the plain Sn-Zn solder alloy, which is attributed to the fine microstructure and second phase strengthening. The spreadability property analysis indicated that the wettability of the Sn-Zn-Cu solder alloys firstly increased and then decreased with the increase in Cu content. The spreading area of the Sn29Zn0.6Cu0.4 solder alloy was increased by 27.8% compared to that of the plain Sn-Zn solder due to Cu consuming excessive free state Zn. With the increase in Cu content, the thickness of the IMC layer decreased owing to Cu diminishing the diffusion force of Zn element to the interface.

Observations of Changes in Rate Dependent Flow of SnAgCu Solder Alloys Due to Aging

2009 ◽  
Author(s):  
Sri Chaitra Chavali ◽  
Kaushik Mysore ◽  
Ganesh Subbarayan ◽  
Indranath Dutta
Keyword(s):  
Diffusion Processes ◽  
Flow Behavior ◽  
Intermetallic Particle ◽  
Particle Growth ◽  
Secondary Creep ◽  
Aging Effects ◽  
Solder Alloys ◽  
Creep Tests ◽  
Snagcu Solder ◽  
And Behavior

Aging affects both microstructure and behavior [1, 2]. Microstructural changes are driven by dislocation motion and diffusion processes. Together they affect the flow behavior in solder alloys. We address four aspects of solder microstructure and behavior as affected by aging (a) EDS studies on Ag dispersion in Sn matrix (b) a procedure for modeling intermetallic particle growth (c) a model for estimating effective viscosity of solder alloy (d) both primary and secondary creep models to predict aging effects on behavior. Solder samples were aged for different aging times (15, 30, 60, 90 days aging) and at different aging temperatures (25 C, 75 C, 125 C) prior to running creep tests. Another set of solder samples were similarly aged to characterize the microstructure. The creep data for the experiments are from a series of sixty four experiments performed using a micromechanical tester that is specially fitted with a sensitive capacitance gauge (with a resolution of 0.1 microns) to accurately measure viscoplastic responses of solder to applied loads.

Constitutive Behavior of Sn3.8Ag0.7Cu and Sn1.0Ag0.5Cu Alloys at Creep and Low Strain Rate Regimes

2007 ◽  
Author(s):  
D. Bhate ◽  
D. Chan ◽  
G. Subbarayan ◽  
T. C. Chiu ◽  
V. Gupta ◽  
...  
Keyword(s):  
Test Data ◽  
Constitutive Models ◽  
Bulk Sample ◽  
Lead Free ◽  
Creep Model ◽  
Model Parameters ◽  
Solder Alloys ◽  
Snagcu Solder ◽  
Reported Data ◽  
Lead Free Solders

Constitutive models for SnAgCu solder alloys are of great interest at the present. Commonly, constitutive models that have been successfully used in the past for Sn-Pb solders are used to describe the behavior of SnAgCu solder alloys. Two issues in the modeling of lead-free solders demand careful attention: (i) Lead-free solders show significantly different creep strain evolution with time, stress and temperature, and the assumption of evolution to steady state creep nearly instantaneously may not be valid in SnAgCu alloys and (ii) Models derived from bulk sample test data may not be reliable when predicting deformation behavior at the solder interconnection level for lead-free solders due to the differences in the inherent microstructures at these different scales. In addition, the building of valid constitutive models from test data derived from tests on solder joints must deconvolute the effects of joint geometry and its influence on stress heterogeneity. Such issues have often received insufficient attention in prior constitutive modeling efforts. In this study all of the above issues are addressed in developing constitutive models of Sn3.8Ag0.7Cu and Sn1.0Ag0.5Cu solder alloys, which represent the extremes of Ag composition that have been mooted at the present time. The results of monotonic testing are reported for strain rates ranging from 4.02E-6 to 2.40E-3 s−1. The creep behavior at stress levels ranging from 7.8 to 52 MPa are also described. Both types of tests were performed at temperatures of 25°C, 75°C and 125°C. The popular Anand model and the classical time-hardening creep model are fit to the data and the experimentally obtained model parameters are reported. The test data are compared against other reported data in the literature and conclusions are drawn on the plausible sources of error in the data reported in the prior literature.

Thermal Fatigue and Failure Analysis of SnAgCu Solder Alloys With Minor Pb Additions

2011 ◽  
Vol 1 (10) ◽  
pp. 1594-1600 ◽  
Author(s):  
Maurice N. Collins ◽  
Jeff Punch ◽  
Richard Coyle ◽  
Michael Reid ◽  
Richard Popowich ◽  
...  
Keyword(s):  
Failure Analysis ◽  
Thermal Fatigue ◽  
Solder Alloys ◽  
Snagcu Solder

The Size Effect on the Creep Properties of SnAgCu-Solder Alloys

2007 ◽  
Author(s):  
S. Wiese ◽  
M. Roellig ◽  
M. Mueller ◽  
S. Bennemann ◽  
M. Petzold ◽  
...  
Keyword(s):  
Size Effect ◽  
Solder Alloys ◽  
Creep Properties ◽  
Snagcu Solder
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