Warpage Behavior and Life Prediction of a Chip-on-Flex Package Under a Thermal Cycling Condition

2014 ◽  
Vol 4 (7) ◽  
pp. 1144-1151 ◽  
Author(s):  
Jae-Won Jang ◽  
Kyoung-Lim Suk ◽  
Jin-Hyoung Park ◽  
Kyung-Wook Paik ◽  
Soon-Bok Lee
Keyword(s):  
Thermal Cycling ◽  
Life Prediction ◽  
Thermal Cycling Condition ◽  
Cycling Condition

Improved reliability of copper-cored solder joints under a harsh thermal cycling condition

2012 ◽  
Vol 52 (7) ◽  
pp. 1441-1444 ◽  
Author(s):  
Yunsung Kim ◽  
Hyelim Choi ◽  
Hyoungjoo Lee ◽  
Dongjun Shin ◽  
Jinhan Cho ◽  
...  
Keyword(s):  
Thermal Cycling ◽  
Solder Joints ◽  
Thermal Cycling Condition ◽  
Cycling Condition

Damage Mechanisms of 5A06 Al Alloy Weld Joints under Constant Load and Thermal Cycling Condition

2007 ◽  
Vol 539-543 ◽  
pp. 368-373 ◽  
Author(s):  
Cheng Jin ◽  
Ji Tai Niu ◽  
Shi Yu He ◽  
Hong Bin Geng ◽  
G. Long
Keyword(s):  
Thermal Cycling ◽  
Mechanical Performance ◽  
Base Material ◽  
Constant Load ◽  
Al Alloy ◽  
Damage Mechanisms ◽  
Weld Joints ◽  
Thermal Cycling Condition ◽  
Cycling Condition ◽  
Alloy Weld

In this paper, the micro-damage mechanisms of 5A06 Al alloy weld joints have been studied under the condition of constant load and cyclic thermal load. The mechanical performance variation of the base material and its weld joint are analyzed and compared. Microstructure analysis reveals that the main damage mechanism in weld joints is the interior voids nucleation and growth. The voids distribution and evolution govern the damage process. Test results also show most fractures occur at HAZ near the welding fusion line. The development of these voids results in the performance deterioration of the weld joints under thermal cycling condition.

Recent Advances and Trends in Fan-Out Wafer/Panel-Level Packaging

2019 ◽  
Vol 141 (4) ◽  
Author(s):  
John H. Lau
Keyword(s):  
Thermal Cycling ◽  
Thermal Performance ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Direct Imaging ◽  
Printed Circuit ◽  
Thermal Cycling Condition ◽  
Recent Advances ◽  
Cycling Condition

The recent advances and trends in fan-out wafer/panel-level packaging (FOW/PLP) are presented in this study. Emphasis is placed on: (A) the package formations such as (a) chip first and die face-up, (b) chip first and die face-down, and (c) chip last or redistribution layer (RDL)-first; (B) the RDL fabrications such as (a) organic RDLs, (b) inorganic RDLs, (c) hybrid RDLs, and (d) laser direct imaging (LDI)/printed circuit board (PCB) Cu platting and etching RDLs; (C) warpage; (D) thermal performance; (E) the temporary wafer versus panel carriers; and (F) the reliability of packages on PCBs subjected to thermal cycling condition. Some opportunities for FOW/PLP will be presented.

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