Deformation mechanism and its effect on electrical conductivity of ACF flip chip package under thermal cycling condition: An experimental study

In this paper, the micro-damage mechanisms of 5A06 Al alloy weld joints have been studied under the condition of constant load and cyclic thermal load. The mechanical performance variation of the base material and its weld joint are analyzed and compared. Microstructure analysis reveals that the main damage mechanism in weld joints is the interior voids nucleation and growth. The voids distribution and evolution govern the damage process. Test results also show most fractures occur at HAZ near the welding fusion line. The development of these voids results in the performance deterioration of the weld joints under thermal cycling condition.

Download Full-text

Study on Al Alloy Welded Joint Performance Deterioration under Thermal Cycling Condition

Key Engineering Materials - Progresses in Fracture and Strength of Materials and Structures ◽

10.4028/0-87849-456-1.1919 ◽

2007 ◽

pp. 1919-1922

Author(s):

Cheng Jin ◽

Ji Tai Niu ◽

Shi Yu He ◽

Hong Bin Geng

Keyword(s):

Thermal Cycling ◽

Welded Joint ◽

Al Alloy ◽

Joint Performance ◽

Thermal Cycling Condition ◽

Performance Deterioration ◽

Cycling Condition

Download Full-text

Visco-Elastic Effect of Underfill Material in Reliability Analysis of Flip-Chip Package

ASME 2009 InterPACK Conference, Volume 1 ◽

10.1115/interpack2009-89152 ◽

2009 ◽

Cited By ~ 1

Author(s):

Yoshihiko Kanda ◽

Kunihiro Zama ◽

Yoshiharu Kariya ◽

Takao Mikami ◽

Takaya Kobayashi ◽

...

Keyword(s):

Fatigue Life ◽

Reliability Analysis ◽

Flip Chip ◽

Cooling Process ◽

Thermal Cycling Condition ◽

Solder Bumps ◽

The Difference ◽

Analytical Result ◽

Underfill Material ◽

Cycling Condition

The effect of viscoelasticity of underfill on the reliability analysis of flip-chip package by using FEA has been investigated in this study. The analytical result on thermal warpage of a package is different depending on whether the underfill is assumed to be elastic or viscoelastic. The difference is prominent in materials with low Tg, specifically during the cooling process. The viscoelastic effect of the underfill on the fatigue life of the solder bumps is also appears in materials with low Tg, and the predicted fatigue life of a package is about twice as short if the underfill is assumed to be elastic instead of viscoelastic. Thus, the differences in the assumption regarding the viscoelastic properties of the underfill affect the reliability analysis of the packages under thermal cycling condition using FEA.

Download Full-text

Recent Advances and Trends in Fan-Out Wafer/Panel-Level Packaging

Journal of Electronic Packaging ◽

10.1115/1.4043341 ◽

2019 ◽

Vol 141 (4) ◽

Cited By ~ 11

Author(s):

John H. Lau

Keyword(s):

Thermal Cycling ◽

Thermal Performance ◽

Printed Circuit Board ◽

Circuit Board ◽

Direct Imaging ◽

Printed Circuit ◽

Thermal Cycling Condition ◽

Recent Advances ◽

Cycling Condition

The recent advances and trends in fan-out wafer/panel-level packaging (FOW/PLP) are presented in this study. Emphasis is placed on: (A) the package formations such as (a) chip first and die face-up, (b) chip first and die face-down, and (c) chip last or redistribution layer (RDL)-first; (B) the RDL fabrications such as (a) organic RDLs, (b) inorganic RDLs, (c) hybrid RDLs, and (d) laser direct imaging (LDI)/printed circuit board (PCB) Cu platting and etching RDLs; (C) warpage; (D) thermal performance; (E) the temporary wafer versus panel carriers; and (F) the reliability of packages on PCBs subjected to thermal cycling condition. Some opportunities for FOW/PLP will be presented.

Download Full-text