Effect of the Curing Properties and Viscosities of Nonconductive Films on the Solder Joint Morphology and Reliability of Chip-On-Board Packages Using Cu-Pillar/Sn–Ag Bumps

2020 ◽  
Vol 10 (5) ◽  
pp. 924-928
Author(s):  
HanMin Lee ◽  
SeYong Lee ◽  
TaeJin Choi ◽  
SooIn Park ◽  
Eun Kyoung Ko ◽  
...  
Keyword(s):  
Solder Joint ◽  
Cu Pillar ◽  
Joint Morphology

Development of Stacking Process for 3D TSV (Through Silicon Via) Structure using Laser

2017 ◽  
Vol 2017 (1) ◽  
pp. 000067-000071 ◽  
Author(s):  
Kwang-Seong Choi ◽  
Wagno Alves Braganca ◽  
Keon-Soo Jang ◽  
Hyun-Cheol Bae ◽  
Yong-Sung Eom
Keyword(s):  
Solder Joint ◽  
Through Silicon Via ◽  
Solder Bumps ◽  
Laser Bonding ◽  
Joint Morphology

Abstract TSV chips were designed and fabricated to investigate the effects of the types of the stacking process on the manufacturability. Two processes were compared: thermocompression and laser bonding. The pitch of UBMs, solder bumps, and TSVs were 50μm. A fluxing underfill was developed and used as a pre-applied underfill during the stacking process. The bonding profiles and the solder joint morphology based on the thermocompression and the laser bonding were compared.

Ultrasonic Wave Scattering by a Line Crack in a Solder Joint

1999 ◽  
Vol 11 (1) ◽  
pp. 117-135
Author(s):  
P. Dineva ◽  
D. Gross ◽  
T. Rangelov
Keyword(s):  
Solder Joint ◽  
Ultrasonic Wave ◽  
Wave Scattering ◽  
Line Crack

Does Pain and Loss of Function Correlate with Joint Morphology in CMC OA?

2015 ◽  
Vol 04 (S 02) ◽  
Author(s):  
J.J. Crisco ◽  
T. Patel ◽  
D. Moore ◽  
A.L. Ladd ◽  
A-P.C. Wiess
Keyword(s):  
Loss Of Function ◽  
Joint Morphology
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