A Study on the Dynamic Bending Property of Chip-on-Flex Assembly Using Anchoring Polymer Layer Anisotropic Conductive Films
2020 ◽
Vol 10
(6)
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pp. 941-948
2018 ◽
Vol 8
(10)
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pp. 1723-1728
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2019 ◽
Vol 9
(7)
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pp. 1235-1243
2019 ◽
Vol 9
(2)
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pp. 209-215
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Keyword(s):
2019 ◽
Vol 9
(5)
◽
pp. 830-835
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2020 ◽
Vol 10
(3)
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pp. 368-377