A Study on the Dynamic Bending Reliability of Chip-in-Fabrics(CIF) Packages Using Anisotropic Conductive Films (Acfs) Materials For Flexible Electronic Applications
2020 ◽
Vol 10
(6)
◽
pp. 941-948
1992 ◽
Vol 139
(6)
◽
pp. 500
◽
2006 ◽
Vol 134
◽
pp. 725-730
◽
2009 ◽
Vol 129
(11)
◽
pp. 1978-1980
Keyword(s):
Keyword(s):