A Review of Low Temperature Process Modules Leading Up to the First (≤500 °C) Planar FDSOI CMOS Devices for 3-D Sequential Integration
2021 ◽
Vol 68
(7)
◽
pp. 3142-3148
2016 ◽
Vol 63
(12)
◽
pp. 5060-5063
◽
Keyword(s):
2016 ◽
Vol 213
(9)
◽
pp. 2446-2451
◽
Keyword(s):
Keyword(s):
2008 ◽
Vol 22
(6)
◽
pp. 1114-1121
◽
2004 ◽
Vol 87
(9)
◽
pp. 1782-1784
◽