Modeling of Semiconductor Substrates for RF Applications: Part I--Static and Dynamic Physics of Carriers and Traps

IEEE Transactions on Electron Devices ◽

10.1109/ted.2021.3096777 ◽

2021 ◽

pp. 1-8

Author(s):

M. Rack ◽

F. Allibert ◽

J.-P. Raskin

Keyword(s):

Semiconductor Substrates ◽

Rf Applications

Download Full-text

Modeling of Semiconductor Substrates for RF Applications--Part II: Parameter Impact on Harmonic Distortion

IEEE Transactions on Electron Devices ◽

10.1109/ted.2021.3096781 ◽

2021 ◽

pp. 1-8

Author(s):

M. Rack ◽

F. Allibert ◽

J.-P. Raskin

Keyword(s):

Harmonic Distortion ◽

Semiconductor Substrates ◽

Rf Applications

Download Full-text

Guidelines for the measurement method of power durability for surface acoustic wave (SAW) and bulk acoustic wave (BAW) devices in radio frequency (RF) applications

10.3403/30366384u ◽

2020 ◽

Keyword(s):

Acoustic Wave ◽

Radio Frequency ◽

Surface Acoustic Wave ◽

Measurement Method ◽

Bulk Acoustic Wave ◽

Rf Applications

Download Full-text

Collaborative Research and Development Delivery Order 0024: Synthesis, Processing, and Evaluation of Polymers for RF Applications

10.21236/ada462792 ◽

2006 ◽

Author(s):

Christy R. Vestal

Keyword(s):

Research And Development ◽

Collaborative Research ◽

Rf Applications

Download Full-text

Erratum: Integrated optical mixer for RF applications

Electronics Letters ◽

10.1049/el:19910249 ◽

1991 ◽

Vol 27 (4) ◽

pp. 392

Author(s):

D. Uttamchandani ◽

H.S. Al-Raweshidy

Keyword(s):

Integrated Optical ◽

Rf Applications ◽

Download Full-text

Development and testing of a high voltage direct converter for high power RF applications

IET Pulsed Power Symposium 2006 ◽

10.1049/ic:20060095 ◽

2006 ◽

Author(s):

D.J. Cook ◽

J.C. Clare ◽

P.W. Wheeler

Keyword(s):

High Voltage ◽

Rf Applications

Download Full-text

Analysis of field-plate LDMOS devices for RF applications

9th International Seminar on Power Semiconductors (ISPS 2008) ◽

10.1049/ic:20080226 ◽

2008 ◽

Author(s):

I. Cortes ◽

D. Flores ◽

F. Morancho ◽

S. Hidalgo ◽

J. Rebollo

Keyword(s):

Field Plate ◽

Rf Applications

Download Full-text

A Novel LTCC-based 3D Packaging for Ultrawideband RF Applications

2019 International Conference on Microwave and Millimeter Wave Technology (ICMMT) ◽

10.1109/icmmt45702.2019.8992260 ◽

2019 ◽

Author(s):

Jifan Zhang ◽

Dong Dong ◽

Jianghong Liu ◽

Haoxiang Lai

Keyword(s):

3D Packaging ◽

Rf Applications

Download Full-text

Design and performance of UHF and L-band oscillators using thin-film resonators on semiconductor substrates

[1991] Proceedings of the 34th Midwest Symposium on Circuits and Systems ◽

10.1109/mwscas.1991.252038 ◽

2002 ◽

Author(s):

S.G. Burns ◽

R.J. Weber

Keyword(s):

Thin Film ◽

Semiconductor Substrates ◽

L Band ◽

And Performance ◽

Thin Film Resonators

Download Full-text

Prospects of Two-dimensional Material-based Field-Effect Transistors for Analog/RF Applications

2021 34th International Conference on VLSI Design and 2021 20th International Conference on Embedded Systems (VLSID) ◽

10.1109/vlsid51830.2021.00021 ◽

2021 ◽

Author(s):

Arjun Kumar ◽

Akhilesh Rawat ◽

Brajesh Rawat

Keyword(s):

Field Effect ◽

Field Effect Transistors ◽

Two Dimensional ◽

Rf Applications

Download Full-text

Area-Efficient Extended 3-D Inductor Based on TSV Technology for RF Applications

IEEE Transactions on Very Large Scale Integration (VLSI) Systems ◽

10.1109/tvlsi.2020.3036385 ◽

2020 ◽

pp. 1-10

Author(s):

Chenbing Qu ◽

Zhangming Zhu ◽

Yunfei En ◽

Liwei Wang ◽

Xiaoxian Liu

Keyword(s):

Rf Applications ◽

Download Full-text