Performance Analysis of Optical MEMS Based Pressure Sensor Using Ring Resonators Structure on Circular Diaphragm

Author(s):  
Anup M Upadhyaya ◽  
Maneesh Srivastava ◽  
Preeta Sharan ◽  
T Srinivas
Author(s):  
Pinki Kumari ◽  
Kuldeep Singh ◽  
Anuj Singal

Today, Hygroscopic swelling is one of the biggest challenging problem of Epoxy mold compound (EMC) in packaging with Microelectromechanical system (MEMS) devices. To overcome this hygroscopic swelling problem of EMC and guard the devices, MEMS devices are molded in this paper with different Mold Compound (MC) i.e. titanium and ceramic etc. during their interconnection with the board. Also, a comparatively performance analysis of this various mold compound with MEMS pressure sensor has been studied in this paper at 60% humidity, 140 mol/m<sup>3</sup> saturation concentration and 25 <sup>o</sup>C. It was observed that hygroscopic swelling does not take place in the titanium mold compound. But, titanium is very costly so we have to consider something cheaper material i.e. ceramic in this paper. The Hygroscopic swelling in Ceramic Mold Compound after 1 year is nearly 0.05mm which is very less than epoxy.


2014 ◽  
Vol 21 (5) ◽  
pp. 1073-1079 ◽  
Author(s):  
Sumit Kumar Jindal ◽  
Sanjeev Kumar Raghuwanshi

2011 ◽  
Vol 483 ◽  
pp. 206-211 ◽  
Author(s):  
Li Bo Zhao ◽  
Xu Dong Fang ◽  
Yu Long Zhao ◽  
Zhuang De Jiang ◽  
Yong Li

A pressure sensor in the range of 25 MPa with circular diaphragm is designed and fabricated, and the calibration experiments prove its excellent performance, which also reflects the correct choice of design after analyzing the effect of diaphragm dimension, location and shapes of piezoresistors. Circular diaphragms of different thickness and diameters are simulated to meet the pressure requirement of 25 MPa. It also displays the advantage of piezoresistive sensors over others and the difference characteristics between different types of piezoresistive sensors. And then the effect of piezoresistor location is analyzed and simulated to attain high accuracy and sensitivity after the circular diaphragm chip is packaged with borosilicate glass ring. The whole fabrication process of the chip is inexpensive and compatible with standard MEMS process. The experimental results show the developed high pressure sensor with the sensitivity of 2.533 mV/MPa has excellent performance, such as linearity of 0.08%FS, hysteresis of 0.03%FS, accuracy of 0.11%FS and repeatability of 0.03%FS under high temperature of 200 °C.


Pressure sensing and measurement are of utmost importance in many of the process industries and biomedical applications. The key element of the pressure sensor is diaphragm and the diaphragm design including shape and dimensions play a major role in sensitivity of pressure sensor irrespective of the type of sensor viz. capacitive, piezoresistive or piezoelectric sensor. The acoustic pressure sensors require the proper analysis of dynamic performance of the key element since the acoustic source is dynamic pressure. This paper presents the stationary and dynamic performance analysis of diaphragm for piezoelectric acoustic pressure sensor. The analysis has been done for better deflection of the diaphragm and optimized stress and strain in order to achieve maximum sensitivity. In design step, at first the diaphragm is analysed for natural frequency, modal frequencies and bandwidth of the structure since the piezoelectric resonant sensors can be used for sensing whenresonant frequency of the membrane is at least 3 to 5 times the highest applied frequency and for energy harvesting applications, when it is almost equal to the applied frequency.Hence, a comparison of shapes of diaphragm, with their fundamental and modal frequencies, deflection, and stress and strain is established. Further a resonant sensor structure is also analyzed for dynamic performance with cavity neck of different size to understand the importance of cavity neck in dynamic performance of the sensor. The circular diaphragm is found be the best choice from the point of view of maximum deflection and natural frequency and the structure with cavity neck has better bandwidth and deflection.


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