Theoretical Study of Miniaturization of a Silicon Vapor Chamber for Compact Microelectronics

2018 ◽  
Author(s):  
Quentin Struss ◽  
Perceval Coudrain ◽  
Jean-Philippe Colonna ◽  
Abdelkader Souifi ◽  
Christian Goutrand ◽  
...  
Keyword(s):  
Theoretical Study ◽  
Vapor Chamber ◽  
Silicon Vapor

Experimental and theoretical study of a water-vapor chamber thermal diode

2019 ◽  
Vol 138 ◽  
pp. 173-183 ◽  
Author(s):  
M.Y. Wong ◽  
B. Traipattanakul ◽  
C.Y. Tso ◽  
Christopher Y.H. Chao ◽  
Huihe Qiu
Keyword(s):  
Water Vapor ◽  
Theoretical Study ◽  
Vapor Chamber

Study of Miniaturization of a Silicon Vapor Chamber for Compact 3D Microelectronics, via a Hybrid Analytical and Finite Element Method

2019 ◽  
Vol 6 (5) ◽  
pp. 01-18
Author(s):  
Ma Yue ◽  
Shirazy Mahmoud ◽  
Coudrain Perceval ◽  
Colonna Jean-Phulippe ◽  
Souifi Abdelkader ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Numerical Models ◽  
Computational Cost ◽  
Vapor Chamber ◽  
Cooling Systems ◽  
Heat Spreaders ◽  
Operating Limits ◽  
Silicon Vapor ◽  
Core Height ◽  
Low Computational Cost

The interest in silicon vapor chambers (SVCs) has increased in the recent years as they have been identified as efficient cooling systems for microelectronics. They present the advantage of higher thermal conductivity and smaller form factor compared to conventional heat spreaders. This work aims to investigate the potential miniaturization of these devices, preliminary to integration on the backside of mobile device chips, located as close as possible to hotspots. While detailed numerical models of vapor chamber operation are developed, an easy modeling with low computational cost is needed for an effective parametric study.  Based on the study of the operating limits, this paper shows the thinning potential of a water filled micropillar for a device operating below 10 W and identify the corresponding vapour core height, and wick thickness.

scholarly journals Study of Miniaturization of a Silicon Vapor Chamber for Compact 3D Microelectronics, via a Hybrid Analytical and Finite Element Method

2019 ◽  
Vol 7 (6) ◽  
pp. 1-16
Author(s):  
Yue MA ◽  
M. R. S. Shirazy ◽  
Q. Struss ◽  
P. Coudrain ◽  
J.P. Colonna ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Numerical Models ◽  
Computational Cost ◽  
Vapor Chamber ◽  
Cooling Systems ◽  
Heat Spreaders ◽  
Operating Limits ◽  
Silicon Vapor ◽  
Core Height ◽  
Low Computational Cost

The interest in silicon vapor chambers (SVCs) has increased in the recent years as they have been identified as efficient cooling systems for microelectronics. They present the advantage of higher thermal conductivity and smaller form factor compared to conventional heat spreaders. This work aims to investigate the potential miniaturization of these devices, preliminary to integration on the backside of mobile device chips, located as close as possible to hotspots. While detailed numerical models of vapor chamber operation are developed, an easy modeling with low computational cost is needed for an effective parametric study.  Based on the study of the operating limits, this paper shows the thinning potential of a water filled micropillar for a device operating below 10 W and identify the corresponding vapour core height, and wick thickness.

scholarly journals Characterization and thermal modeling of a miniature silicon vapor chamber for die-level heat redistribution

2020 ◽  
Vol 152 ◽  
pp. 119569 ◽  
Author(s):  
Tanya Liu ◽  
Marc T. Dunham ◽  
Ki Wook Jung ◽  
Baoxing Chen ◽  
Mehdi Asheghi ◽  
...  
Keyword(s):  
Thermal Modeling ◽  
Vapor Chamber ◽  
Silicon Vapor

Design and fabrication of an ultra-thin silicon vapor chamber for compact electronic cooling

2020 ◽  
Author(s):  
Quentin Struss ◽  
Perceval Coudrain ◽  
Jean-Philippe Colonna ◽  
Abdelkader Souifi ◽  
Christian Gontrand ◽  
...  
Keyword(s):  
Electronic Cooling ◽  
Vapor Chamber ◽  
Silicon Vapor ◽  
Thin Silicon
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