Development of an In-Line Capable Transient Thermal Analysis Equipment for a Power Module with Five Half Bridges
2018 ◽
Vol 2018
(HiTEC)
◽
pp. 000028-000031
◽
Keyword(s):
Evaluation of Thermal Resistance Degradation of SiC Power Module Corresponding to Thermal Cycle Test
2017 ◽
Vol 2017
(HiTEN)
◽
pp. 1-5
◽
Thermal Resistance and Transient Thermal Analysis of SiC Power Module Using Ni Micro Plating Bonding
2019 ◽
Vol 139
(10)
◽
pp. 838-846
◽
Keyword(s):
2009 ◽
Vol 8
(3)
◽
pp. 271-280
◽
Keyword(s):
Keyword(s):
Keyword(s):