scholarly journals Debye Frequency-Extended Waveguide Permittivity Extraction for High Complex Permittivity Materials: Concrete Setting Process Characterization

2020 ◽  
Vol 69 (8) ◽  
pp. 5604-5613 ◽  
Author(s):  
Giselle Gonzalez-Lopez ◽  
Sebastian Blanch ◽  
Jordi Romeu ◽  
Lluis Jofre
2003 ◽  
Author(s):  
Andrew Li ◽  
Adam B. Butler
Keyword(s):  

2019 ◽  
Vol 10 (3) ◽  
pp. 244-257
Author(s):  
İclal Kaya Altay ◽  
◽  
Shqiprim Ahmeti ◽  

The Treaty establishing a Constitution for Europe ads territorial cohesion as Union’s third goal, beside economic and social cohesion and lists it as a shared competence. In the other hand, the Lisbon Strategy aims to turn Europe into the most competitive area of sustainable growth in the world and it is considered that the Territorial cohesion policy should contribute to it. This paper is structured by a descriptive language while deduction method is used. It refers to official documents, strategies, agendas and reports, as well as books, articles and assessments related to topic. This paper covers all of two Territorial Agendas as well as the background of territorial cohesion thinking and setting process of territorial cohesion policy.


Author(s):  
A.V. Donchenko ◽  
◽  
V.V. Zemlyakov ◽  
M.A. Marahovskiy ◽  
A.E. Panich ◽  
...  

1985 ◽  
Vol 23 (1) ◽  
pp. 1
Author(s):  
Shelley N. Phillips ◽  
Gale L. Pretash

The implementation and enforcement of standards regulating acid-causing emissions in Alberta are examined in this paper. Also addressed are the available forums for public input, the need for further scientific analysis and better communication between government, industry and the public.


Author(s):  
Erika Schutte ◽  
Jack Martin

Abstract An ellipsometry based measurement protocol was developed to evaluate changes to MEMS sensor surfaces which may occur during packaging using unpatterned test samples. This package-level technique has been used to measure the 0-20 Angstrom thin films that can form or deposit on die during the packaging process for a variety of packaging processing conditions. Correlations with device performance shows this to be a useful tool for packaged MEMS device and process characterization.


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