An Evaluation of Deadlock-Handling Strategies in Semiconductor Cluster Tools

2005 ◽  
Vol 18 (1) ◽  
pp. 197-201 ◽  
Author(s):  
S. Venkatesh ◽  
J.S. Smith
Mathematics ◽  
2021 ◽  
Vol 9 (9) ◽  
pp. 1029
Author(s):  
Ying-Mei Tu

Since last decade, the cluster tool has been mainstream in modern semiconductor manufacturing factories. In general, the cluster tool occupies 60% to 70% of production machines for advanced technology factories. The most characteristic feature of this kind of equipment is to integrate the relevant processes into one single machine to reduce wafer transportation time and prevent wafer contaminations as well. Nevertheless, cluster tools also increase the difficulty of production planning significantly, particularly for shop floor control due to complicated machine configurations. The main objective of this study is to propose a short-term scheduling model. The noteworthy goal of scheduling is to maximize the throughput within time constraints. There are two modules included in this scheduling model—arrival time estimation and short-term scheduling. The concept of the dynamic cycle time of the product’s step is applied to estimate the arrival time of the work in process (WIP) in front of machine. Furthermore, in order to avoid violating the time constraint of the WIP, an algorithm to calculate the latest time of the WIP to process on the machine is developed. Based on the latest process time of the WIP and the combination efficiency table, the production schedule of the cluster tools can be re-arranged to fulfill the production goal. The scheduling process will be renewed every three hours to make sure of the effectiveness and good performance of the schedule.


Author(s):  
Martin Hosek ◽  
Michael Valasek ◽  
Jairo Moura

This paper presents single- and dual-end-effector configurations of a planar three-degree of freedom parallel robot arm designed for automated pick-place operations in vacuum cluster tools for semiconductor and flat-panel-display manufacturing applications. The basic single end-effector configuration of the arm consists of a pivoting base platform, two elbow platforms and a wrist platform, which are connected through two symmetric pairs of parallelogram mechanisms. The wrist platform carries an end-effector, the position and angular orientation of which can be controlled independently by three motors located at the base of the robot. The joints and links of the mechanism are arranged in a unique geometric configuration which provides a sufficient range of motion for typical vacuum cluster tools. The geometric properties of the mechanism are further optimized for a given motion path of the robot. In addition to the basic symmetric single end-effector configuration, an asymmetric costeffective version of the mechanism is derived, and two dual-end-effector alternatives for improved throughput performance are described. In contrast to prior attempts to control angular orientation of the end-effector(s) of the conventional arms employed currently in vacuum cluster tools, all of the motors that drive the arm can be located at the stationary base of the robot with no need for joint actuators carried by the arm or complicated belt arrangements running through the arm. As a result, the motors do not contribute to the mass and inertia properties of the moving parts of the arm, no power and signal wires through the arm are necessary, the reliability and maintenance aspects of operation are improved, and the level of undesirable particle generation is reduced. This is particularly beneficial for high-throughput applications in vacuum and particlesensitive environments.


2010 ◽  
Vol 450 ◽  
pp. 365-368
Author(s):  
James C. Chen ◽  
Chia Wen Chen ◽  
Kou Huang Chen ◽  
Chien Hsin Lin

Wafer fabrication is a capital intensive industry. A 12-inch wafer fabrication plant needs a typical investment of US$ 3 billion, and the equipment cost constitutes about two-thirds to three-quarters of the total production costs. Therefore, capacity planning is crucial to the investment and performance of wafer fabrication plants. Several formulae are presented to calculate the required number of machines with sequential, parallel, and batch processing characteristics, respectively. An AutoSched AP simulation model using data from real foundry fabrication plants is used in a case study to evaluate the performance of the proposed formulae. Simulation results indicate that the proposed formulae can quickly and accurately calculate the required number of cluster tools leading to the required monthly output rate.


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