Enhanced Boiling of FC-72 on Silicon Chips With Micro-Pin-Fins and Submicron-Scale Roughness

2001 ◽  
Vol 124 (2) ◽  
pp. 383-390 ◽  
Author(s):  
H. Honda ◽  
H. Takamastu ◽  
J. J. Wei

Experiments were conducted to study the effects of micro-pin-fins and submicron-scale roughness on the boiling heat transfer from a silicon chip immersed in a pool of degassed and gas-dissolved FC-72. Square pin-fins with fin dimensions of 50×50×60μm3 (width×thickness×height) and submicron-scale roughness (RMS roughness of 25 to 32 nm) were fabricated on the surface of square silicon chip 10×10×0.5mm3 by use of microelectronic fabrication techniques. Experiments were conducted at the liquid subcoolings of 0, 3, 25, and 45 K. Both the micro-pin-finned chip and the chip with submicron-scale roughness showed a considerable heat transfer enhancement as compared to a smooth chip in the nucleate boiling region. The chip with submicron-scale roughness showed a higher heat transfer performance than the micro-pin-finned chip in the low-heat-flux region. The micro-pin-finned chip showed a steep increase in the heat flux with increasing wall superheat. This chip showed a higher heat transfer performance than the chip with submicron-scale roughness in the high-heat-flux region. The micro-pin-finned chip with submicron-scale roughness on it showed the highest heat transfer performance in the high-heat-flux region. While the wall superheat at boiling incipience was strongly dependent on the dissolved gas content, it was little affected by the liquid subcooling.

2013 ◽  
Vol 589-590 ◽  
pp. 559-564
Author(s):  
Xi Bing Li ◽  
Yun Shi Ma ◽  
Xun Wang ◽  
Ming Li

As a highly efficient heat transfer component, a micro heat pipe (MHP) has been widely applied to the situations with high heat flux concentration. However, a MHPs heat transfer performance is affected by many factors, among which, working fluid inventory has great influence on the security, reliability and frost resistance of its heat transfer performance. In order to determine the appropriate working fluid inventory for grooved MHPs, this paper first analyzed the working principle, major heat transfer limits and heat flux distribution law of grooved MHPs in electronic chips with high heat flux concentration, then established a mathematic model for the working fluid inventory in grooved MHPs. Finally, with distilled water being the working fluid, a series of experimental investigations were conducted at different temperatures to test the heat transfer performances of grooved MHPs, which were perfused with different inventories and with different adiabatic section lengths. The experimental results show that when the value of α is roughly within 0.40±0.05, a grooved MHP can acquire its best heat transfer performance, and the working fluid inventory can be determined by the proposed mathematic model. Therefore this study solves the complicated problem of determining appropriate working fluid inventory for grooved MHPs.


2013 ◽  
Vol 135 (6) ◽  
Author(s):  
Satish G. Kandlikar ◽  
Theodore Widger ◽  
Ankit Kalani ◽  
Valentina Mejia

Flow boiling in microchannels has been extensively studied in the past decade. Instabilities, low critical heat flux (CHF) values, and low heat transfer coefficients have been identified as the major shortcomings preventing its implementation in practical high heat flux removal systems. A novel open microchannel design with uniform and tapered manifolds (OMM) is presented to provide stable and highly enhanced heat transfer performance. The effects of the gap height and flow rate on the heat transfer performance have been experimentally studied with water. The critical heat fluxes (CHFs) and heat transfer coefficients obtained with the OMM are significantly higher than the values reported by previous researchers for flow boiling with water in microchannels. A record heat flux of 506 W/cm2 with a wall superheat of 26.2 °C was obtained for a gap size of 0.127 mm. The CHF was not reached due to heater power limitation in the current design. A maximum effective heat transfer coefficient of 290,000 W/m2 °C was obtained at an intermediate heat flux of 319 W/cm2 with a gap of 0.254 mm at 225 mL/min. The flow boiling heat transfer was found to be insensitive to flow rates between 40–333 mL/min and gap sizes between 0.127–1.016 mm, indicating the dominance of nucleate boiling. The OMM geometry is promising to provide exceptional performance that is particularly attractive in meeting the challenges of high heat flux removal in electronics cooling applications.


2016 ◽  
Vol 2016 (0) ◽  
pp. I111
Author(s):  
Kio Takai ◽  
Kazuhisa Yuki ◽  
Yoshiki Indou ◽  
Risako Kibushi ◽  
Noriyuki Unno ◽  
...  

Author(s):  
Junmei Wu ◽  
Jiyun Zhao ◽  
Yun Wang

As a novel strategy to improve heat transfer characteristics of fluids by the addition of solid particles with diameters below 100 nm, nanofluids exhibits unprecedented heat transfer properties and are being considered as potential working fluids to be used in high heat flux systems such as nuclear reactors, electronic cooling systems and solar collectors. The present paper reviews the state-of-the-art studies on nanofluid boiling heat transfer performance and critical heat flux (CHF) enhancement. It is found that some results on nanofluids boiling heat transfer performance are inconsistent or contradictory in data published. The knowledge on the mechanism of nanofluids boiling CHF enhancement is insufficient. Bubble dynamics of nanofluids boiling is suggested to be investigated to identify the exact contributions of solid surface modifications and suspended nanoparticles to CHF enhancement in nanofluids boiling heat transfer.


Author(s):  
Kazuhisa Yuki ◽  
Akira Matsui ◽  
Hidetoshi Hashizume ◽  
Koichi Suzuki

Heat transfer characteristics of micro-sized bronze particle-sintered porous heat sinks and copper minichannel-fins heat sinks are experimentally investigated in order to clarify the feasibility of a newly proposed micro/mini cooling device using fins-installed porous media. Regarding the porous heat sinks, fin effect toward more inside of the porous medium is promoted by sintering the porous heat sink on the heat transfer surface, which results in increasing the heat transfer performance up to 0.8MW/m2K at heat flux of 8.2MW/m2 though there still remains a large pressure loss issue. In addition, the results clarify that the heat exchanging area exists only in the vicinity of the heat transfer surface. As to the minichannel-fins heat sinks, the influence of the channel width and the fin thickness are evaluated in detail. As a result, the minichannel-fins heat sink having the narrower channel width (i.e. scale effect) and lower porosity (i.e. thicker fin thickness with larger heat capacity) achieves higher heat transfer performance up to 0.10MW/m2K at 8.3MW/m2. However, rapid increase of pressure loss, which is occasionally observed in a microchannel due to vapor bubbles choking the narrow channel, still remains as an issue under flow boiling conditions in the minichannel. Finally, heat transfer performance of the fin-installed porous heat sink is numerically predicted by the control volume method. The simulation confirms that the heat transfer coefficient at each wall superheat of 0 and 30 degrees has performance 2.5 times and 2.0 times higher than that of the normal fins, which indicates that this heat sink coupling the micro and mini channels has high potential as efficient cooling method under high heat flux conditions exceeding 10MW/m2.


Author(s):  
Yan Wang ◽  
Xiang Ling

The heat transfer performance of fluid flowing in a microchannel was experimentally studied, to meet the requirement of extremely high heat flux removal of microelectronic devices. There were 10 parallel microchannels with rectangular cross-section in the stainless steel plate, which was covered by a glass plate to observe the fluid flowing behavior, and another heating plate made of aluminum alloy was positioned behind the microchannel. Single phase heat transfer and fluid flow downstream the microchannel experiments were conducted with both deionized water and ethanol. Besides experiments, numerical models were also set up to make a comparison with experimental results. It is found that the pressure drop increases rapidly with enlarging Reynolds number (200), especially for ethanol. With comparison, the flow resistance of pure water is smaller than ethanol. Results also show that the friction factor decreases with Reynolds number smaller than the critical value, while increases the velocity, the friction factor would like to keep little changed. We also find that the water friction factors obtained by CFD simulations in parallel microchannels are much larger than experiment results. With heat flux added to the fluid, the heat transfer performance can be enhanced with larger Re number and the temperature rise could be weaken. Compared against ethanol, water performed much better for heat removal. However, with intensive heat flux, both water and ethanol couldn’t meet the requirement and the temperature at outlet would increase remarkably, extremely for ethanol. These findings would be helpful for thermal management design and optimization.


2020 ◽  
Vol 143 (1) ◽  
Author(s):  
Yongtong Li ◽  
Liang Gong ◽  
Minghai Xu ◽  
Yogendra Joshi

Abstract In this paper, a concept of metal foam heat sink with pin fins (MFPF heat sink) is proposed to improve the cooling performance of high-powered electronics with nonuniform heat flux. Numerical simulations are carried out to investigate the thermohydraulic performance of MFPF heat sink, and the metal foam (MF) heat sink and traditional pin fin (PF) heat sink are employed for comparison. The capability of MFPF heat sink in handling nonuniform heat flux is examined under different power levels. It indicates that the MFPF heat sink greatly enhances the heat transfer performance, due to the common effects of the improved flow distribution and enhanced overall effective thermal conductivity (ETC). Results also show that the MFPF heat sink promotes the improvement of the bottom wall temperature uniformity. Porosity has more pronounced effects on heat transfer performance of MFPF heat sink than pore density. A nonuniform distribution heat flux (15–80–15 W/cm2) can be successfully dissipated using the proposed MFPF heat sink with the junction temperature below 95 °C at Re of 500.


Author(s):  
Sai Sujith Obuladinne ◽  
Huseyin Bostanci

Two-phase spray cooling has been an emerging thermal management technique offering high heat transfer coefficients (HTCs) and critical heat flux (CHF) levels, near-uniform surface temperatures, and efficient coolant usage that enables to design of compact and lightweight systems. Due to these capabilities, spray cooling is a promising approach for high heat flux applications in computing, power electronics, and optics. The two-phase spray cooling inherently depends on saturation temperature-pressure relationships of the working fluid to take advantage of high heat transfer rates associated with liquid-vapor phase change. When a certain application requires strict temperature and/or pressure conditions, thermophysical properties of the working fluid play a critical role in attaining proper efficiency, reliability, or packaging structure. However, some of the commonly used working fluids today, including refrigerants and dielectric liquids, have relatively poor properties and heat transfer performance. In such cases, utilizing binary mixtures to tune working fluid properties becomes an alternative approach. This study aimed to conduct an initial investigation on the spray cooling characteristics of practically important binary mixtures and demonstrate their capability for challenging high heat flux applications. The working fluid, water/2-propanol binary mixture at various concentration levels, specifically at x1 (liquid mass fraction of 2-proponal in water) of 0.0 (pure water), 0.25, 0.50, 0.879 (azeotropic mixture) and 1.0, represented both non-azeotropic and azeotropic cases. Tests were performed on a closed loop spray cooling system using a pressure atomized spray nozzle with a constant liquid flow rate at corresponding 20°C subcooling conditions and 1 Atm pressure. A copper test section measuring 10 mm × 10 mm × 2 mm with a plain, smooth surface simulated high heat flux source. Experimental procedure involved controlling the heat flux in increasing steps, and recording the steady-state temperatures to obtain cooling curves in the form of surface superheat vs heat flux. The obtained results showed that pure water (x1 = 0.0) and 2-propanol (x1 = 1.0) provide the highest and lowest heat transfer performance, respectively. At a given heat flux level, the HTC values indicated strong dependence on x1, where the HTCs depress proportional to the concentration difference between the liquid and vapor phases. The CHF values sharply decreased at x1≥ 0.25.


Energies ◽  
2021 ◽  
Vol 14 (13) ◽  
pp. 3893
Author(s):  
Mohd Danish ◽  
Mohammed K. Al Mesfer ◽  
Khursheed B. Ansari ◽  
Mudassir Hasan ◽  
Abdelfattah Amari ◽  
...  

In the current work, the heat flux in nucleate pool boiling has been predicted using the macrolayer and latent heat evaporation model. The wall superheat (ΔT) and macrolayer thickness (δ) are the parameters considered for predicting the heat flux. The influence of operating parameters on instantaneous conduction heat flux and average heat flux across the macrolayer are investigated. A comparison of the findings of current model with Bhat’s decreasing macrolayer model revealed a close agreement under the nucleate pool boiling condition at high heat flux. It is suggested that conduction heat transfer strongly rely on macrolayer thickness and wall superheat. The wall superheat and macrolayer thickness is found to significantly contribute to conduction heat transfer. The predicted results closely agree with the findings of Bhat’s decreasing macrolayer model for higher values of wall superheat signifying the nucleate boiling. The predicted results of the proposed model and Bhat’s existing model are validated by the experimental data. The findings also endorse the claim that predominant mode of heat transfer from heater surface to boiling liquid is the conduction across the macrolayer at the significantly high heat flux region of nucleate boiling.


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