Heat Transfer Behavior of Silica Nanoparticles in Pool Boiling Experiment

2008 ◽  
Vol 130 (4) ◽  
Author(s):  
Denitsa Milanova ◽  
Ranganathan Kumar
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Chemical Composition ◽  
Particle Deposition ◽  
Ph Value ◽  
Pool Boiling ◽  
High Heat ◽  
Boiling Regime ◽  
High Heat Transfer ◽  
The Wire

The heat transfer characteristics of silica (SiO2) nanofluids at 0.5vol% concentration and particle sizes of 10nm and 20nm in pool boiling with a suspended heating Nichrome wire have been analyzed. The influence of acidity on heat transfer has been studied. The pH value of the nanosuspensions is important from the point of view that it determines the stability of the particles and their mutual interactions toward the suspended heated wire. When there is no particle deposition on the wire, the nanofluid increases critical heat flux (CHF) by about 50% within the uncertainty limits regardless of pH of the base fluid or particle size. The extent of oxidation on the wire impacts CHF, and is influenced by the chemical composition of nanofluids in buffer solutions. The boiling regime is further extended to higher heat flux when there is agglomeration on the wire. This agglomeration allows high heat transfer through interagglomerate pores, resulting in a nearly threefold increase in burnout heat flux. This deposition occurs for the charged 10nm silica particle. The chemical composition, oxidation, and packing of the particles within the deposition on the wire are shown to be the reasons for the extension of the boiling regime and the net enhancement of the burnout heat flux.

Heat Transfer Behavior of Oxide Nanoparticles in Pool Boiling Experiment

2006 ◽  
Author(s):  
Denitsa Milanova ◽  
Ranganathan Kumar ◽  
Satyanarayana Kuchibhatla ◽  
Sudipta Seal
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Chemical Composition ◽  
Particle Deposition ◽  
Ph Value ◽  
Pool Boiling ◽  
Oxide Particle ◽  
Boiling Regime ◽  
High Heat Transfer ◽  
The Wire

The heat transfer characteristics of silica (SiO2), ceria (CeO2), and alumina (Al2O3) nanofluids at 0.5% concentration and particle size of 10nm and 20 nm in pool boiling have been analyzed. The influence of acidity on heat transfer has been studied. The pH value of the nanosuspensions is important from the point of view that it determines the stability of the particles, their mutual interactions towards the wire. When there is no particle deposition on the wire, the nanofluid with any oxide suspension increases CHF by about 50% within uncertainty limits regardless of the type of the oxide particle and its size. The extent of oxidation on the wire impacts CHF, and is influenced by the chemical composition of nanofluids in buffer solutions. Amorphous oxides (SiO2) are generally more disordered and less closely packed compared to the crystalline oxides such as CeO2 and Al2O3. The arrangement of the atoms within the unit cell and the layer of water molecules at the surface possibly influence the natural convection as well as the CHF. The boiling regime is further extended to higher heat flux when there is agglomeration on the wire. This agglomeration allows high heat transfer through interagglomerate pores, resulting in a nearly 3-fold increase in CHF. This deposition occurs for the charged 10 nm silica particle, and was not seen for other oxide particles. The chemical composition, oxidation and packing of the particles within the deposition on the wire are shown to be the reasons for the extension of the boiling regime and the net enhancement of the Critical Heat Flux.

Observations of the Critical Heat Flux Process During Pool Boiling of FC-72

2014 ◽  
Vol 136 (4) ◽  
Author(s):  
J. Jung ◽  
S. J. Kim ◽  
J. Kim
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Critical Heat Flux ◽  
Pool Boiling ◽  
High Heat ◽  
Line Length ◽  
Boiling Curve ◽  
High Heat Flux ◽  
Transfer Coefficients ◽  
Ir Camera

Experimental work was undertaken to investigate the process by which pool-boiling critical heat flux (CHF) occurs using an IR camera to measure the local temperature and heat transfer coefficients on a heated silicon surface. The wetted area fraction (WF), the contact line length density (CLD), the frequency between dryout events, the lifetime of the dry patches, the speed of the advancing and receding contact lines, the dry patch size distribution on the surface, and the heat transfer from the liquid-covered areas were measured throughout the boiling curve. Quantitative analysis of this data at high heat flux and transition through CHF revealed that the boiling curve can simply be obtained by weighting the heat flux from the liquid-covered areas by WF. CHF mechanisms proposed in the literature were evaluated against the observations.

Heat Transfer Analysis of Microgrooved Evaporator and Condenser Surfaces Utilized in a High Heat Flux Two-Phase Flow Loop

2007 ◽  
Author(s):  
Edvin Cetegen ◽  
Thomas Baummer ◽  
Serguei Dessiatoun ◽  
Michael Ohadi
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
High Heat ◽  
Phase Flow ◽  
Transfer Coefficients ◽  
Two Phase ◽  
Pressure Drops ◽  
Heat Transfer Coefficients ◽  
High Heat Transfer ◽  
Microgrooved Surface

This paper investigates the heat transfer and pressure drop analysis of micro grooved surfaces utilized in evaporators and condensers of a two-phase flow cooling loop. These devices utilize the vapor-liquid phase change to transfer large amounts of heat, and they offer substantially higher heat flux performance with lower pumping power than most liquid cooling technologies. Microgrooved surfaces, combined with force-fed evaporation and condensation technology discussed in this paper yield high heat transfer coefficients with low pressure drops. Our most recent results, aiming to test the limits of the technology, demonstrated dissipation of almost 1kW/cm2 from silicon electronics using HFE 7100 as the working fluid. In a compact two phase system, the heat generated by the electronic components can be absorbed by microgrooved evaporators and rejected through the microgrooved surface condensers to liquid cooled slots with high heat transfer coefficients and low pressure drops on the refrigerant side. In the case of air-cooling, the same microgrooved surface heat exchanger can reject heat with a heat transfer coefficient of 3847 W/cm2 and a pressure drop of 4156 Pa. These heat transfer processes have the added capability of being combined and used together in a self-contained system cooled either by liquid or air.

Enhanced Pool Boiling Performance on Micro-, Nano-, and Hybrid-Structured Surfaces

2011 ◽  
Author(s):  
Qian Li ◽  
Wei Wang ◽  
Chris Oshman ◽  
Benoit Latour ◽  
Chen Li ◽  
...  
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Thermal Management ◽  
Pool Boiling ◽  
High Heat ◽  
High Heat Flux ◽  
Maximum Heat ◽  
Structured Surfaces ◽  
Maximum Heat Transfer ◽  
Functional Components

Thermal management plays an important role in both high power electronics and energy conversion systems. A key issue in thermal management is the dissipation of the high heat flux generated by functional components. In this paper, various microstructures, nanostructures and hybrid micro/nano-structures were successfully fabricated on copper (Cu) surfaces, and the corresponding pool boiling heat transfer performance was systematically studied. It is found that the critical heat flux (CHF) of hybrid structured surfaces is about 15% higher than that of the surfaces with nanowires only and micro-pillars only. More importantly, the superheat at CHF for the hybrid structured surface is much smaller than that of the micro-pillared surface (about 35%), and a maximum heat transfer coefficient (HTC) of about 90,000W/m2K is obtained. Compared with the known best pool boiling performance on biporous media, a much larger HTC and much lower superheat at a heat flux of 250W/cm2 have been obtained on the novel hybrid-structured surfaces.

Visualization of pool boiling and occurring critical heat flux on coiled wire

2020 ◽  
pp. 095440892094211
Author(s):  
Kianoush DolatiAsl ◽  
Younes Bakhshan ◽  
Ehsan Abedini
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Critical Heat Flux ◽  
Variable Temperature ◽  
Pool Boiling ◽  
Saturation Temperature ◽  
Sudden Increase ◽  
Fluid Temperature ◽  
Liquid Temperature ◽  
The Wire

Pool boiling is used in various industries and play a significant role in heat transfer. So far, multiple studies have been carried out on investigating boiling and applying heat flux on the wire. In the present paper, the boiling of the coiled wire under atmospheric pressure conditions has been investigated. The fluid temperature inside the pool is considered under both constant (equal to saturation temperature) and variable temperature conditions. The value of the ring density in the coiled wire is considered to be variable. Based on the results, changing the pool liquid temperature changes bubble departure diameter and frequency. Also, increasing the density of the coil ring increases the diameter of bubbles. It has been observed that the bubbles are usually formed inside the coil, and after moving to the two ends of the coil, they leave the coil. However, by increasing the amount of heat flux and the pool liquid temperature, the size of bubbles will be larger; therefore, the bubbles must leave the coil from the empty spaces between the rings. By increasing the amount of applied heat flux, the coil was enclosed in a layer of vapor, which results in a decrease in the amount of heat transfer coefficient, and finally, a sudden increase in temperature on the wire will occur, which indicates the critical heat flux. Also, it has been observed that the critical heat flux always arises in the coil region of wire and not in the straight part of the wire.

Horizontal-Tube Falling-Film Evaporation With Structured Surfaces

1989 ◽  
Vol 111 (2) ◽  
pp. 518-524 ◽  
Author(s):  
M.-C. Chyu ◽  
A. E. Bergles
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Pool Boiling ◽  
Nucleate Boiling ◽  
High Heat ◽  
High Flux ◽  
Falling Film ◽  
Structured Surfaces ◽  
Film Evaporation ◽  
Falling Film Evaporation

Extensive experimental tests for tubes with commercial structured surfaces in a horizontal single-tube falling-film evaporator were conducted. The test sections were hollow copper cylinders with GEWA-T, Thermoexcel-E, or High Flux surfaces electrically heated by inserted cartridge heaters. A smooth surface cylinder was also tested for reference. All tubes were tested in both pool boiling and falling-film evaporation with water. The results reveal that falling-film evaporation provides much higher heat transfer coefficients than pool boiling in the low heat flux, convective region. The GEWA-T surface enhances heat transfer through its increased and accessible area, while Thermoexcel-E and High Flux demonstrate high heat transfer performances because of enhanced nucleate boiling. The falling-film evaporation data for the structured surfaces either merge or show a tendency to merge with the respective pool boiling curves at high heat fluxes. Unusual incipient boiling behavior of Thermoexcel-E and the effects of factors such as surface aging, surface subcooling, film flow rate, liquid feed height, and rate of heat flux change, are described.

High Heat Flux Dissipation Using Symmetric Dual-Taper Manifold in Pool Boiling

2019 ◽  
Author(s):  
Aranya Chauhan ◽  
Satish G. Kandlikar
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Pool Boiling ◽  
Heat Removal ◽  
Heating Surface ◽  
High Heat ◽  
Copper Surface ◽  
High Heat Flux ◽  
Maximum Heat ◽  
Continuous Increase

Abstract The trend of miniaturization in electronics presents a great challenge in the thermal management of devices. The continuous increase in the number of transistors in the processor leads to high heat flux generation, limiting the performance of the device. Boiling heat transfer offers a great heat removal competency while maintaining the low chip temperatures. The critical heat flux (CHF) dictates the maximum heat removal ability, and heat transfer coefficient (HTC) defines the efficiency of the boiling process. This pool boiling study is focused on using a manifold containing a symmetric dual taper over the heating surface. The heat transfer performance of this configuration is evaluated for different taper angles in the manifold. The macro-convection assisted by vapor columns during boiling enhance the CHF and HTC limit significantly. A CHF of 287 W/cm2 with an HTC of 116 kW/cm2°C was achieved with a plain copper surface, representing greater than a 2-fold increases in each over a plain surface.

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