scholarly journals Fabrication of High Aspect Ratio Porous Microfeatures Using Hot Compaction Technique

2008 ◽  
Vol 130 (3) ◽  
Author(s):  
Peng Chen ◽  
Gap-Yong Kim ◽  
Jun Ni
Keyword(s):  
Aspect Ratio ◽  
High Aspect Ratio ◽  
Heat Transfer Performance ◽  
Experimental Setup ◽  
Production Environment ◽  
Taper Angle ◽  
High Productivity ◽  
Powder Consolidation ◽  
Hot Compaction ◽  
High Temperature Operation

High aspect ratio porous microfeatures are becoming more important in the modern industry. However, the fabrication of such features under a mass production environment remains a challenge when robustness, cost effectiveness, and high productivity requirements are required. In this study, the forming of such porous microfeatures using hot compaction was investigated. A hot compaction experimental setup was designed and fabricated that is capable of performing high temperature operation (700°C), quick heatup, and avoiding oxidation. 3D thermal simulation of the experimental setup was conducted to investigate the heat transfer performance and internal temperature distribution, which was then used as a reference for the experiment. Hot compaction experiments were carried out, and the effects of compression force and temperature on the quality in terms of powder consolidation strength and porosity were investigated. In addition, the achievable aspect ratio and taper angle were also discussed.

Forming of Porous Micro-Features Using Hot Compaction

2007 ◽  
Author(s):  
Peng Chen ◽  
Gap-Yong Kim ◽  
Jun Ni
Keyword(s):  
Heat Transfer ◽  
High Temperature ◽  
Mass Production ◽  
Heat Transfer Characteristics ◽  
High Productivity ◽  
Powder Consolidation ◽  
Micro Scale ◽  
Hot Compaction ◽  
Micro Features ◽  
High Temperature Operation

Porous metallic micro-scale features are becoming important in the modern industry. However, a mass production of such features is a challenge when robustness, cost-effectiveness, and high productivity requirements are considered. In this study, the fabrication of such porous micro-features using hot compaction was investigated. A hot compaction experiment setup was designed and fabricated, which was capable of high temperature operation (up to 700 °C), quick heat-up, and avoiding oxidation of workpiece and tools. A 3D thermal simulation of the experiment setup was conducted to understand the heat transfer characteristics of the system, which was used as a reference for the experiment. The effects of compression loading force and temperature on the compact quality in terms of powder consolidation strength and porosity were studied.

Laser Micromachining of Thin Beams for Silicon MEMS: Optimization of Cutting Parameters Using the Taguchi Method

2015 ◽  
Author(s):  
Tim P. Pusch ◽  
Mario D’Auria ◽  
Nima Tolou ◽  
Andrew S. Holmes
Keyword(s):  
Surface Roughness ◽  
Aspect Ratio ◽  
Taguchi Method ◽  
High Aspect Ratio ◽  
Side Wall ◽  
Cutting Parameters ◽  
Taper Angle ◽  
Aspect Ratios ◽  
Thin Beams ◽  
Optimization Of Cutting Parameters

While thin beams are widely used structural elements in Micro-Electro-Mechanical-Systems (MEMS) there are very few studies investigating the laser machining of clean high aspect ratio silicon beams. This work presents a systematic study of selected influencing cutting parameters with the goal of machining high aspect ratio beams with low side wall surface roughness (Ra) and high cross section verticality, i.e. low taper angle. The Taguchi method was used to find the optimal setting for each of the selected parameters (pulse frequency, laser diode current, pulse overlap, number of patterns to be marked, gap size between patterns) utilizing orthogonal arrays and signal-to-noise (S/N) ratio analysis. Double-sided clamped beams of 100μm width and 10mm length were machined in silicon wafers of 525μm thickness using a nanosecond solid-state UV laser system (355nm wavelength). Our experimental results show that beams with an aspect ratio as high as 17.5 can be manufactured. Furthermore, a surface roughness of Ra = 0.37μm and taper angle of α = 2.52 degrees can be achieved. This will make the fast fabrication of MEMS devices with aspect ratios as high as those from deep reactive ion etching possible.

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