Finite Element Modeling for Optimizing Hermetic Package Reliability
1989 ◽
Vol 111
(4)
◽
pp. 255-260
◽
Keyword(s):
The thermal stresses in microwave packages are studied by the finite element method. Emphasis is placed on the effects of material construction and design on the reliability of very small hermetic packages. Three different microwave packages have been designed and six finite element models (two for each design) have been analyzed. To verify the validity of the finite element results, some leak tests have been performed and the results agree with the analytical conclusions. The results presented herein should provide a better understanding of the thermal behavior of hermetic packages and should be useful for their optimal design.
Keyword(s):
2011 ◽
Vol 243-249
◽
pp. 4112-4118
2014 ◽
Vol 555
◽
pp. 419-424
◽
2000 ◽
Vol 2
(7)
◽
pp. 438-442
◽
Keyword(s):
2008 ◽
Vol 116
(1357)
◽
pp. 941-949
◽
Keyword(s):
2005 ◽
Vol 194
(36-38)
◽
pp. 3838-3869
◽
Keyword(s):