The Interface Crack in a Combined Tension-Compression and Shear Field

1979 ◽  
Vol 46 (2) ◽  
pp. 345-348 ◽  
Author(s):  
Maria Comninou ◽  
D. Schmueser

The interface crack was analyzed in two recent papers which considered applied tension and shear fields separately. The unrealistic oscillatory singularities and the ensuing material interpenetration were eliminated in these solutions by assuming small frictionless contact zones near the crack tips. The present paper presents a solution for the interface crack under combined normal and shear tractions. Both tensile and compressive normal tractions are considered and numerical results of the extents of the contact zones, shear stress-intensity factors, and interface crack opening profiles are presented.

1978 ◽  
Vol 45 (2) ◽  
pp. 287-290 ◽  
Author(s):  
Maria Comninou

The interface crack in a tension field was reconsidered in a recent paper, and the unrealistic oscillatory singularities were eliminated by assuming small frictionless contact zones near the crack tips. In the present paper, the interface crack in a shear field is studied. Some unexpected results emerge: one of the contact zones is large, affecting thus the global nature of the solution; the gap closes extremely abruptly at one of its ends, but the normal stresses remain zero at this point; and the shear stress-intensity factors have opposite signs at the crack tips.


1991 ◽  
Vol 58 (2) ◽  
pp. 428-434 ◽  
Author(s):  
H. A. Luo ◽  
Y. Chen

An arc-shaped crack in fiber-reinforced composite material is the subject of this paper. A three-phase composite cylinder is taken as the material model to take into account the effect of surrounding fibers. Using Muskhelishvili’s complex variable method, an exact elastic solution is derived based on the conventional crack opening assumption. The complex stress intensity factors for the interface crack, in the sense defined by Hutchinson, Mear, and Rice, are determined. Some numerical examples are given. It is shown that, as the volume concentration of the fiber is increased, the magnitude of the complex stress intensity factors varies considerably.


Author(s):  
Won-Keun Kim ◽  
Toru Ikeda ◽  
Noriyuki Miyazaki

Anisotropic Conductive Adhesive Film (ACF) has been used for electronic assemblies such as the connection between a Liquid Crystal Display (LCD) panel and a flexible print circuit board (FPC). ACF is expected to be a key technology for flip chip packaging and chip size packaging. The goal of our work is to provide an optimum design scheme to achieve the best combination of electrical performance and mechanical reliability for electronic packages using the ACF. This study presents an evaluation technology for the delamination of the ACF connections. We utilized the stress intensity factors of an interface crack between jointed dissimilar materials. The evaluation technology presented herein was found to provide reliability of an electronic package using the ACF connection during the solder reflow process.


Ultrasonics ◽  
1983 ◽  
Vol 21 (2) ◽  
pp. 57-64 ◽  
Author(s):  
A.V. Clark ◽  
R.B. Mignogna ◽  
R.J. Sanford

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